Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth

Wang, Y.W.; Chang, Chih-Chiang; Kao, C. R.

doi:10.1016/j.jallcom.2008.11.027

Cited by 81 publications

(41 citation statements)

References 16 publications

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“…Nanoadditions lead to a transition of the morphology of the interfacial IMC layer from a scallop to a more planar type, which should improve the joint strength, while needle-like microstructures were observed in SAC solder joints with bulk Ni additions which might deteriorate the mechanical properties; 17,25 In contrast to the bulk, nanoinclusions did not lead to the formation of large amounts of (Cu,Ni) 6 Sn 5 grains near the solder/Cu interface as well as to a growth of the average thickness of the interfacial IMC layer. 18 …”

Section: Microstructure Analysismentioning

confidence: 99%

“…14 For instance, the SAC solders and solder joints with Ni as alloying element 17,18 or as addition in form of micro-or NPs were intensively investigated in Refs. 6, 7, 14, and 19-21. In this work, we report the changes of microstructure and mechanical properties (shear strength and microhardness) of Cu/SAC305/Cu solder joints caused by minor additions of Ni and intermetallic Ni 3 Sn and Ni 3 Sn 2 NPs.…”

Section: Introductionmentioning

confidence: 99%

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Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Yakymovych

Švec

Orovčík

et al. 2017

Journal of Elec Materi

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This study investigates the effect of minor additions of Ni, Ni 3 Sn or Ni 3 Sn 2 nanoparticles on the microstructure and mechanical properties of Cu/solder/ Cu joints. The nanocomposite Sn-3.0Ag-0.5Cu (SAC305) solders with 0.5, 1.0 and 2.0 wt.% metallic nanoparticles were prepared through a paste mixing method. The employed Ni and Ni-Sn nanoparticles were produced via a chemical reduction method. The microstructure of as-solidified Cu/solder/Cu joints was studied by x-ray diffraction and scanning electron microscopy. The results showed that additions of Ni and Ni-Sn nanoparticles to the SAC305 solder paste lead initially to a decrease in the average thickness of the intermetallic compound layer in the interface between solder and substrate, while further additions up to 2.0 wt.% did not induce any significant changes. In addition, shear strength and microhardness tests were performed to investigate the relationship between microstructure and mechanical properties of the investigated solder joints. The results indicated an increase in both of these properties which was most significant for the solder joints using SAC305 with 0.5 wt.% Ni or Ni-Sn nanoparticles.

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Section: Microstructure Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Yakymovych

Švec

Orovčík

et al. 2017

Journal of Elec Materi

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“…According to the Cu-Sn phase diagram, there are two intermetallic phases which exist below 100°C, Cu 3 Sn (ϵ-phase) and Cu 6 Sn 5 (ή-phase). The latter is richer in Sn content as compared to the former and is the only phase formed in bimetallic Cu-Sn films aged at room temperature [3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

“…The formation and growth of intermetallic compounds of Cu-Sn have been extensively studied [4][5][6][7][8][9][10][11][12][13]. In the pioneering works of Tu and his coworkers [3,14,15] the most important conclusions, obtained in thin film systems with Sn and Cu thicknesses in the range of 180-2500 nm, were as follows: i) The reaction between the Cu and Sn started spontaneously during the deposition at room temperature and led to the formation of Cu 6 Sn 5 phase.…”

Section: Introductionmentioning

confidence: 99%

Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu–Sn bilayers at room temperature

Zaka

Shenouda

Fouad

et al. 2016

Microelectronics Reliability

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a b s t r a c tSolid state reaction between nanocrystalline Cu and Sn films was investigated at room temperature by depth profiling with secondary neutral mass spectrometry and by X-ray diffraction. A rapid diffusion intermixing was observed leading to the formation of homogeneous Cu 6 Sn 5 layer. There is no indication of the appearance of the Cu 3 Sn phase. This offers a way for solid phase soldering at low temperatures, i.e. to produce homogeneous Cu 6 Sn 5 intermediate layer of several tens of nanometers during reasonable time (in the order of hours or less). From the detailed analysis of the growth of the planar reaction layer, formed at the initial interface in Sn(100 nm)/Cu(50 nm) system, the value of the parabolic growth rate coefficient at room temperature is 2.3 × 10 −15 cm 2 /s. In addition, the overall increase of the composition near to the substrate inside the Cu film was interpreted by grain boundary diffusion induced solid state reaction: the new phase formed along the grain boundaries and grew perpendicular to the boundary planes. From the initial slope of the composition versus time function, the interface velocity during this reaction was estimated to be about 0.5 nm/h.

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“…High current density in small solder joints increases the occurrence of EM failures [8]. Researchers are putting a great deal of efforts to improve the reliability of lead-free solders in EM by minor addition(s), either in the form of alloying element(s) [9,10] or as micro/nano particles [11][12][13]. Reported studies on the particle addition mainly use paste mixing [1,14,15] methods.…”

Section: Introductionmentioning

confidence: 99%

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

et al. 2015

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The characteristics of interfacial intermetallic compounds (IMCs) can have serious impact on the reliability of solder joints. In this study, Ni nanoparticles (NPs) were added to SAC305 solder/Cu substrate interface by flux mixing. The effects of Ni NP addition on electromigration (EM) under high current density were investigated. EM tests with a maximum duration of 1128 h were conducted under a current density of 1 9 10 4 A/cm 2 , at 80 ± 3°C on the solders prepared using 0 and 2 wt% Ni NPs-doped flux. At 2 wt% Ni NPs addition to flux, the growth rate of interfacial IMC at the anode side decreased by more than five times. No significant change in electrical resistance was observed in 2 wt% samples for up to 1128 h. Ni NP addition at the solder/substrate through flux mixing is, therefore, expected to lead to more reliable solder joints.

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Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth

Cited by 81 publications

References 16 publications

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu–Sn bilayers at room temperature

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

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