Abstract:a b s t r a c tSolid state reaction between nanocrystalline Cu and Sn films was investigated at room temperature by depth profiling with secondary neutral mass spectrometry and by X-ray diffraction. A rapid diffusion intermixing was observed leading to the formation of homogeneous Cu 6 Sn 5 layer. There is no indication of the appearance of the Cu 3 Sn phase. This offers a way for solid phase soldering at low temperatures, i.e. to produce homogeneous Cu 6 Sn 5 intermediate layer of several tens of nanometers d… Show more
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