“…16 The conductor loss was calculated theoretically using the known resistivity of the copper metallization and the measured rms surface roughness. 17 The loss tangent of the BST thick film was determined from the known conductor losses, measured line loss and known permittivity of the BST thick film.…”
“…16 The conductor loss was calculated theoretically using the known resistivity of the copper metallization and the measured rms surface roughness. 17 The loss tangent of the BST thick film was determined from the known conductor losses, measured line loss and known permittivity of the BST thick film.…”
“…The spacer is planar and porous, thus ensuring uniform back support while distributing the vacuum equally throughout the surface and mitigating any potential deflection of the flexible substrate. The above topology can be easily analyzed as a multilayer CPW [30]. …”
Section: Characterization Methodologymentioning
confidence: 99%
“…In the conventional approach, first the ef f is inferred from the scattering parameter measurements by means of a conformal mapping method (CMM) in combination with a parallel capacitance technique (PCT), which provides closed form formulas for ef f of the device [30]. However, CMM is based on quasi TEM propagation and requires multiple elliptical integrals to evaluate the filling factors.…”
Section: B Modeling Based Interpolation and Optimizationmentioning
Abstract-In this paper, we propose a robust microwave characterization of inkjet printed components on flexible substrates, which aim at measuring the material properties of silver nanoparticle inks and the supporting dielectric spacer employed during measurements. Starting with propagation constant extracted from multiline thru-reflect-line calibration with coplanar waveguide (CPW) standards and then proceeding with finite element modeling of CPWs, the proposed technique can dynamically produce an interpolated search space by automatic driving of simulation tools. In the final stage, the algorithm utilizes a least-square optimization routine to minimize the deviation between model and measurements. Our technique significantly reduces the computing resources and is able to extract the material parameters using even a nominal ink profile. Characteristic impedances for CPWs are extracted using series resistor measurements from 10 MHz to 20 GHz. It is also shown that the proposed characterization methodology is able to detect any changes in material properties induced by changes in fabrication parameters such as sintering temperature. Ink conductivities of approximately 2.973 × 10 0.201 × 10 7 S/m respectively. We verified our technique by measuring the material parameters with conventional approach.
“…In [40], a computeraided-design model is developed, to characterize the BST thin films in the frequency range from 1 to 16 GHz. Coplanar waveguides (CPWs) and inter-digital capacitors (IDCs) are fabricated on BST thin films, to determine the complex dielectric constants, voltage tunability and K-factor.…”
Section: Tunable Filters Using Ferroelectric Materialsmentioning
Abstract-An overview of state-of-the-art frequency tunable technologies in the realization of tunable radio frequency (RF) and microwave tunable circuits is presented with focus on filter designs. Those enabling techniques and materials include semiconductors, microelectro-mechanical systems (MEMS), ferroelectric and ferromagnetic materials. Various performance indicators of one-dimensional tunable filters are addressed in terms of tunability, losses, signal integrity and other aspects. Fundamental limitations of the classical one-dimensional tuning method are discussed, which makes use of only one type of tunable elements such as either electric or magnetic tuning/controlling of circuit parameters. Requirements of simultaneous electric and magnetic two-dimensional tuning techniques are highlighted for achieving an unprecedented and advantageous wider modal tuning. It is believed that this emerging scheme will lead its way in the realization of future highly efficient and tunable RF and microwave components and devices.
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