Microstructuring of 45-µm-Deep Dual Damascene Openings in SU-8/Si by UV-Assisted Thermal Imprinting with Opaque Mold

Abstract

Explicit expressions are derived for the macroscopic and the internal strain in the crystalsofthediamondstruchlre with (0Ol)surfacessubjeci toastresapplied from the sides parallel to the (001) direction. The numerical predictions of the surface relaxation at the ideal (001) surfaces of C, Si, Ge and a-Sn crystals are given in tenus of the valence force constants already used for the description of the dynamics of the materials. The results are compared with the existing experimental observations.

Study on Quartz Multitier Mold Fabrication Using Gray Scale Laser Beam Lithography

“…Hence, the demand for an inexpensive, fast, and easy fabrication method for nano-and microscale 2.5D structures is becoming increasingly acute. An imprint lithography, in which a mold is pressed into a resist, forming a negative relief replica of the master topography in the resist, is expected to meet these demands owing to its simplicity and strong potential for the fabrication of 2.5D nano-/microfeatures with a high throughput and at a low cost, and thus has been attempted to be used to produce dualdamascene structures [1][2][3] and optical components. 4) So far, various approaches have been introduced as 2.5D mold fabrication processes including mechanical machining, 5,6) laser direct writing, 6,7) focused ion beam lithography (milling 6) and deposition 8) ), metal anodizing, 9) dry etching combined with optical and electron-beam lithography, 10,11) and replication processes (e.g., mechanical forming and metal electroforming).…”

“…4) So far, various approaches have been introduced as 2.5D mold fabrication processes including mechanical machining, 5,6) laser direct writing, 6,7) focused ion beam lithography (milling 6) and deposition 8) ), metal anodizing, 9) dry etching combined with optical and electron-beam lithography, 10,11) and replication processes (e.g., mechanical forming and metal electroforming). 2,3,12) Among them, the combined uses of dry etching and multistep binary photolithography are the most commonly used method for 2.5D mold fabrication because they offer a balanced combination of lithographic characteristics in terms of machining rate, resolution, and working area. However, these methods are very costly and time-consuming owing to the requirements for variable masks as well as multiple alignments and exposure, i.e., N numbers of masks and processing steps are required for fabricating multitier structures with 2 N levels.…”