Microstructure, sinterability and properties of CaO-B 2 O 3 -SiO 2 glass/Al 2 O 3 composites for LTCC application

Al2O3/glass/hBN composites with high thermal conductivity and low dielectric constant for low temperature cofired ceramic applications

“…The solid lines are drawn to guide the eye. In general, as the hBN content increased, bulk densities decreased at each sintering temperature due to lower density of hBN (e.g., the theoretical density of Al 2 O 3 = 3.93 g/cm 3 , glass = 2.43 g/cm 3 and hBN = 2.1 g/cm 3 [7], respectively). Correspondingly, the AP decreased with increasing densification.…”

“…Addition of low melting glasses has been adopted to lower densification temperature and to optimize physical properties. Luo et al [3] Hexagonal boron nitride (hBN) is an important material in terms of its high thermal conductivity (59 W/m•K parallel and 33 W/m•K perpendicular to basal plane at 25°C [7], an averaged thermal conductivity of 33.5 W/m•K at 25°C [8], 20.4 W/ m•K (parallel to hot-press direction) and 110.57 W/ m•K (perpendicular to hot-press direction) in textured hBN/CaO-Y 2 O 3 -Al 2 O 3 [9]) and very low thermal expansion coefficient (1 ppm/°C along the a/b axis, 4.1 ppm/°C along the c axis) and low dielectric constant (4-4.4 at 1 MHz [7,10], 4.5 and dielectric loss = 0.0003 at 1-10 GHz [11]). hBN is often used as an additive to modify thermomechanical and dielectric properties [12].…”

The tape casting process for manufacturing low‐temperature co‐fired ceramic green sheets: A review

“…42 Although fine powder is detrimental to the relative density of the green sheet, it possesses a higher surface energy, which provides a greater driving force for densification. [43][44][45] Decreasing the particle size resulted in an increase in the amount of dispersant required in both single and mixed powder systems. In the single powder system, the finer powder led to higher green densities.…”

“…This skin can induce streaks or even cracks under the doctor blade. 44 Streicher et al 53 and Guti errez et al 54 noted that the evaporation rate of the solvent was the main cause of tape cracking. This phenomenon is a common problem when screening solvents.…”

Carbon nanotube/graphene oxide‐added CaO‐B2O3‐SiO2 glass/Al2O3 composite as substrate for chip‐type supercapacitor

“…34 CaO-BaO-Al 2 O 3 -B 2 O 3 -SiO 2 / AlN and Li 2 O-SiO 2 -ZrO 2 /Al 2 O 3 glass/ceramic composites exhibit high thermal conductivity, but their mechanical strength is low. 18,[35][36][37][38] Therefore, it is necessary to develop new types of glass/ceramic composites that have both high mechanical strength and good thermal conductivity.…”