2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 2019
DOI: 10.1109/ectc.2019.00171
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Microstructure Signature Evolution in Solder Joints, Solder Bumps, and Micro-Bumps Interconnection in A Large 2.5D FCBGA Package During Thermo-Mechanical Cycling

Arman Ahari
1
,
Andy Hsiao
2
,
Greg Baty
3
et al.
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