Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

El-Daly, A.A.; Hammad, A.E.; Fawzy, A.; Nasrallh, D. A.

doi:10.1016/j.matdes.2012.06.058

Cited by 138 publications

(52 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These results are quite consistent with the explanation proposed by Chen et al [15] that alloying elements with Sn-Ag or Sn-Cu solders tend to be associated with decreasing undercooling. This phenomenon also appeared in SAC105 solder as reported by El-Daly et al [16]. It's well known that low undercooling can promote the nucleation behaviors and enhance nucleus during solidification of liquid solder alloys, which subsequently results in fine structures.…”

Section: Melting and Solidification Of Sn07cu-based Solderssupporting

confidence: 66%

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Liu

et al. 2015

Journal of Alloys and Compounds

View full text Add to dashboard Cite

Section: Melting and Solidification Of Sn07cu-based Solderssupporting

confidence: 66%

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Liu

et al. 2015

Journal of Alloys and Compounds

View full text Add to dashboard Cite

“…The solder ingots were then mechanically machined into wire samples with a gauge length of 4.0 9 10 À2 m and 2.5 9 10 À3 m in diameter, as developed in our previous work. 17 All the ingots were heat-treated at 130°C for 1800 s before being machined to tensile specimens.…”

Section: Experimental Procedures and Designmentioning

confidence: 99%

“…In the present investigation, the mechanical deformation mechanism can be determined by calculating values of the characteristic parameters of the stress exponent (n) and activation energy (Q) according to the following equation 17,27 :…”

Section: Stress Exponent and Activation Energymentioning

confidence: 99%

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Hammad

El-Taher

2014

Journal of Elec Materi

Self Cite

View full text Add to dashboard Cite

The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni) 6 Sn 5 intermetallic compounds (IMCs) inside the b-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni) 6 Sn 5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)-and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

show abstract

“…In the case of the SAC105 alloy, the undercooling varied from 19.15°C to 45.2°C. [27][28][29][30] For the SAC 305 alloy, the undercooling was in the range from 15.4°C to 26.3°C. 28,31,32 The impurities (Ni, Fe and other metals) and strong inhomogeneity may result in such data scattering.…”

Section: Thermal Analysismentioning

confidence: 99%

Effect of Ag and Pb Addition on Microstructural and Mechanical Properties of SAC 105 Solders

Molnár

Janovszky

Kardos

et al. 2015

Journal of Elec Materi

View full text Add to dashboard Cite

Melting and crystallization processes of lead-free and lead-contaminated alloys in near-equilibrium state were investigated. In addition, the effect of silver content up to 4 wt.% on the microstructure of Sn-Ag-Cu alloys was studied. The volume fraction of b-Sn decreased by half owing to 4 wt.% Ag content. Furthermore, contamination by lead strongly influences the properties of the solidified microstructure. The Pb grains appear as a result of two processes when the Pb content is equal to 0.5 wt.% or higher: Pb phase solidifies in the quaternary eutectic at 176°C, and Pb grains precipitate from the primary b-Sn solid solution grain during a solid state reaction. The freezing range enlarges to 51°C due to 2 wt.% Pb content owing to quaternary eutectic. Above 1 wt.% Pb content, the mechanical properties also improve due to grains of quaternary eutectic Pb and precipitated Pb grains with a size <1 lm.

show abstract

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

Cited by 138 publications

References 25 publications

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Effect of Ag and Pb Addition on Microstructural and Mechanical Properties of SAC 105 Solders

Contact Info

Product

Resources

About