Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy

The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5Cu solder alloy

“…Reducing the Ag content of Sn-Ag-Cu alloy increases its bulk compliance and plastic energy dissipation ability, identified as key factors for improving drop resistance [1]. Also, the application of SAC solder alloy is limited by the coarse precipitation of the Cu 6 Sn 5 phase [2] and also a higher melting temperature and lower strength [3]. Some alloying elements, such as Ni [4], Co [5], Ce [6], Fe [7], Ag [8], Sb [9] and Zn [10] have been added into SAC alloys to refine the microstructure, and improve the wettability and mechanical properties.…”

Physical properties of Sn58Bi–xNi lead-free solder and its interfacial reaction with copper substrate

“…Ag, Al, Co, Ga, Ge, In, Ni, Sb, Ti, Zn into a solder is a useful technique to improve the physical properties of the solder. Although these elements could improve certain properties of the solder, they could undesirably alter some properties of the alloy, and different alloying elements react variedly to different solder alloys [10][11][12][13][14][15][16][17][18][19][20][21].…”

Influence of Thermal Aging on Microstructure and Property of Gold Alloy Joint Soldered by Sn-based Solder

“…The extensive investigations have been mostly carried out on the solderability of Au and Au-Sn IMCs formation on gold-plated components [37][38][39][40][41][42][43][44]. But little information is available in the literature on the microstructure evolution and property of gold alloy soldered with Sn-based solder when gold alloy acts as a component with a certain thickness other than as the coating or layer on other metal components, especially for the effect of thermal cycling and temperature aging.…”