Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies

Skwarek, Agata; Ptak, Przemysław; Górecki, Krzysztof; Hurtony, Tamás; Illés, Béla

doi:10.3390/ma13071563

Cited by 27 publications

(17 citation statements)

References 39 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In the assembly of power LEDs, a soldering process is typically used. As previously shown [17,24,25], the composition of the soldering alloy, the type of reflow oven, and the soldering temperature profile in time can influence thermal resistance of a soldering joint between the case of a power LED and the PCB.…”

Section: Introductionmentioning

confidence: 86%

Influence of a Thermal Pad on Selected Parameters of Power LEDs

et al. 2020

Self Cite

View full text Add to dashboard Cite

This paper is devoted to the analysis of the influence of thermal pads on electric, optical, and thermal parameters of power LEDs. Measurements of parameters, such as thermal resistance, optical efficiency, and optical power, were performed for selected types of power LEDs operating with a thermal pad and without it at different values of the diode forward current and temperature of the cold plate. First, the measurement set-up used in the paper is described in detail. Then, the measurement results obtained for both considered manners of power LED assembly are compared. Some characteristics that illustrate the influence of forward current and temperature of the cold plate on electric, thermal, and optical properties of the tested devices are presented and discussed. It is shown that the use of the thermal pad makes it possible to achieve more advantageous values of operating parameters of the considered semiconductor devices at lower values of their junction temperature, which guarantees an increase in their lifetime.

show abstract

Section: Introductionmentioning

confidence: 86%

Influence of a Thermal Pad on Selected Parameters of Power LEDs

et al. 2020

Self Cite

View full text Add to dashboard Cite

show abstract

“…Thermal and optical parameters of the LED assemblies were also measured: real thermal resistance (R th ), electric thermal resistance (R the ), and luminous efficiency (η F ). A custom-designed LED test system was used to measure the diodes' DC current-voltage characteristics, as described by Skwarek et al [32]. Both the thermal and optical parameters of LEDs were measured simultaneously.…”

Section: Evaluation Methodsmentioning

confidence: 99%

Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys

et al. 2021

Self Cite

View full text Add to dashboard Cite

The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %. The wettability, the void formation, the mechanical strength, and the thermoelectric parameters of the composite solder alloys/joints were investigated. Furthermore, microstructural evaluations were performed using scanning electron and ion microscopy. ZnO nanoparticles decreased the composite solder alloys’ wettability, which yielded increased void formation. Nonetheless, the shear strength and the thermoelectric parameters of the composite solder alloy were the same as those of the SACX0307 reference. This could be explained by the refinement effects of ZnO ceramics both on the Sn grains and on the Ag3Sn and Cu6Sn5 intermetallic grains. This could compensate for the adverse impact of lower wettability. After improving the wettability, using more active fluxes, ZnO composite solder alloys are promising for high-power applications.

show abstract

“…TiO 2 . As was proved by Skwarek et al, the addition of TiO 2 to the soldering paste influences the thermal properties of LEDs (Skwarek et al, 2020). It was shown that using soldering paste SACX0307-TiO 2 , it is possible to obtain visibly better thermal properties of soldering joints than using classical paste SACX0307.…”

Section: Introductionmentioning

confidence: 93%

“…The thermal properties of all the layers that ensure heat flow between these elements of the heat flow path are also essential. In particular, solder joints between the device examined and the printed circuit board can affect the efficiency of heat transfer as well (Skwarek et al, 2020;Illés and Hars anyi, 2008).…”

Section: Introductionmentioning

confidence: 99%

The influence of soldering process parameters on the optical and thermal properties of power LEDs

Ptak

Górecki

Skwarek

et al. 2020

SSMT

Self Cite

View full text Add to dashboard Cite

Purpose This paper aims to present the results of investigations that show the influence of soldering process parameters on the optical and thermal parameters of power LEDs. Design/methodology/approach The power LEDs were soldered onto metal core printed circuit board (MCPCB) substrates in different soldering ovens: batch and tunnel types, characterized by different thermal profiles. Three types of solder pastes based on Sn99Ag0.3Cu0.7 with the addition of TiO2 were used. The thermal and optical parameters of the diodes were measured using classical indirect electrical methods. The results of measurements obtained were compared and discussed. Findings It was shown that the type of oven and soldering thermal profile considerably influence the effectiveness of the removal of heat generated in the LEDs tested. This influence is characterized by thermal resistance changes. The differences between the values of this parameter can exceed 20%. This value also depends on the composition of the soldering paste. The differences between the diodes tested can exceed 15%. It was also shown that the luminous flux emitted by the diode depends on the soldering process used. Practical implications The results obtained could be useful for process design engineers for assembling power LEDs for MCPCBs and for designers of solid-state light sources. Originality/value This paper presents the results of investigations into the influence of the soldering profiles and soldering pastes used on the effectiveness of the removal of heat generated in power LEDs. It shows and discusses how the factors mentioned above influence the thermal resistance of the LEDs and optical parameters that characterize the light emitted.

show abstract

Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies

Cited by 27 publications

References 39 publications

Influence of a Thermal Pad on Selected Parameters of Power LEDs

Influence of a Thermal Pad on Selected Parameters of Power LEDs

Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys

The influence of soldering process parameters on the optical and thermal properties of power LEDs

Contact Info

Product

Resources

About