Microstructure formation on low temperature co-fired ceramic green substrates using micro embossing

Shan, Xuechuan; Maw, H. P.; Tjeung, R. T.; Ling, Shangwen; Lu, Chuanhe; Jachowicz, Ryszard

doi:10.1007/s00542-008-0561-z

Cited by 18 publications

(18 citation statements)

References 7 publications

(7 reference statements)

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“…14(c). This phenomenon of overall recessed deformation, which was also observed in another report [12], would occur with the increase of pattern density; and it can be improved by further optimizing the embossing conditions and the pattern design on the mold. …”

Section: Effect Of Process Parameterssupporting

confidence: 66%

Large area roller embossing of multilayered ceramic green composites

Shan

Soh

Shi

et al. 2008

2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

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-This paper presents our latest achievements in developing large area patterning of multilayered ceramic green composites using micro roller embossing. The aim of this research is to develop large area pattern technique for ceramic green substrates using a modified roller laminator, which is compatible with screen printing apparatus, for integration of micro embossing and printing in the future stage. A thin film nickel mold was developed via photolithography, nickel electroplating and photoresist strip-off. The mold had an effective panel size of 150 mm× × × × 150 mm with the height of protrusive micro patterns being about 40 µm. Formation of micro patterns was successfully demonstrated over the whole panel area using roller embossing on laminated ceramic green tapes (HL2000 from Heraeus). Micro patterns for inductors, capacitors as well as interconnection with 50 µm line width were embossed on ceramic green substrates. With the optimized process parameters (including feeding speed, roller temperature and applied pressure), we have demonstrated that micro roller embossing is a promising method for large area patterning of ceramic green substrates.

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Section: Effect Of Process Parameterssupporting

confidence: 66%

Large area roller embossing of multilayered ceramic green composites

Shan

Soh

Shi

et al. 2008

2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Self Cite

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“…In the cases of 10 and 20 kN, the force was increased to its peak value in 5 s, 10 and 20 min. It was found that, a slow force ramp reduced the macro deformation (Shan et al 2008) in a certain degree, but showed little effect in improving the embossed quality of micro patterns.…”

Section: Effect Of Holding Timementioning

confidence: 96%

Study on micro hot embossing of low temperature co-firable ceramic green substrates

et al. 2008

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Multi-layered ceramic substrates with embedded micro patterns are becoming increasingly important, for example, in harsh environment electronics, enabling microsystems and microfluidic devices. Fabrication of these embedded micro patterns, such as micro channels, cavities and vias, is a challenge. This study focuses on the process aspects of patterning micro features on low temperature co-firable ceramic (LTCC) green substrates using micro hot embossing. Green ceramic tapes that possessed near-zero shrinkage in the x-y plane were used, six layers of which were stacked and laminated as a substrate. The process parameters that impact on the embossing fidelity were investigated and optimized in this study. Micro features with channel-width as small as several micrometers were formed on green ceramic substrates. The dynamic thermo-mechanical analysis indicated that extending the holding time at a certain temperature range would harden the substrates with little effect on improving the embossing fidelity. Ceramic substrates with embossed micro patterns were obtained after co-firing; the shrinkage ratios of the embossed depth and channel-width were 8-15 and 12-17%, respectively. The changes of pitches between two embossed channels were within ±1.0% due to the interlocking effect of the ceramic tapes.

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“…The plasticizer with low molecular weight will decompose first, and is followed by the plasticizer having high molecular weight [37]. The weight loss at higher temperature is due to the binder burnout [38]. As the temperature further increased up to 900 1C, the sample do not exhibits weight loss anymore in the TG curve.…”

Section: Al 2 O 3 -Bbsz Ltcc Tapesmentioning

confidence: 98%