“…This grain boundary serration subsequently transformed into several recrystallization nuclei, resulting from a bulging of parts of the serrated HABs accompanied by the formation of sub-boundaries (=LAB) and/or Σ3 twin boundaries, as represented by the black and red arrows in Figure 1c, respectively. The low mobility of LAB under severe plastic deformation at a high temperature stems from the inactive dislocation mobility caused by the stacking-fault formation in the fcc metals (e.g., Au, Ni, Cu, and austenitic Fe) having low/medium stacking fault energy [9,27,28]. It matches with the present study, given that the stacking-fault energy of C-free TWIP steel is the medium value of 54 mJ m −2 based on the thermodynamic calculation [7].…”