Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

Hu, Xiaowu; Xu, Tao; Keer, Leon M.; Li, Yulong; Jiang, Xiongxin

doi:10.1016/j.msea.2016.07.071

Cited by 130 publications

(22 citation statements)

References 37 publications

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“…However, the thickness of Cu 6 Sn 5 and Cu 3 Sn IMCs formed at the interface of SAC solder and Cu substrate during manufacturing, repair and transportation decides the reliability of the solder joints [10]. With miniaturization, the reliability becomes the primary concern in fine pitch solder joints as the high current density and Joule heating drives the diffusion of Cu and Sn atoms along the interface [11].…”

Section: Introductionmentioning

confidence: 99%

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Rajendran

Hwang

Jung

2020

Metals

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This study investigates the shear strength and aging characteristics of Sn-3.0Ag-0.5Cu (SAC 305)/Cu joints by the addition of ZrO2 nanoparticles (NPs) having two different particle size: 5–15 nm (ZrO2A) and 70–90 nm (ZrO2B). Nanocomposite pastes were fabricated by mechanically mixing ZrO2 NPs and the solder paste. ZrO2 NPs decreased the β-Sn grain size and Ag3Sn intermetallic compound (IMC) in the matrix and reduced the Cu6Sn5 IMC thickness at the interface of lap shear SAC 305/Cu joints. The effect is pronounced for ZrO2A NPs added solder joint. The solder joints were isothermally aged at 175 °C for 24, 48, 144 and 256 h. NPs decreased the diffusion coefficient from 1.74 × 10–16 m/s to 3.83 × 10–17 m/s and 4.99 × 10–17 m/s for ZrO2A and ZrO2B NPs added SAC 305/Cu joints respectively. The shear strength of the solder joints decreased with the aging time due to an increase in the thickness of interfacial IMC and coarsening of Ag3Sn in the solder. However, higher shear strength exhibited by SAC 305-ZrO2A/Cu joints was attributed to the fine Ag3Sn IMC’s dispersed in the solder matrix. Fracture analysis of SAC 305-ZrO2A/Cu joints displayed mixed solder/IMC mode upon 256 h of aging.

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Section: Introductionmentioning

confidence: 99%

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Rajendran

Hwang

Jung

2020

Metals

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“…In the literature, investigating the reliability of isothermal aging of Sn-based lead-free solder joints has become an area of interest. Many scholars have studied the isothermal aging characteristics of SnAgCu/Cu [21][22][23][24][25], In-48Sn/Cu [26,27], and Sn-Bi/Cu [28,29] solder joints. They have focused on the growth kinetics of the interfacial IMC and the mechanical properties of solder joints during isothermal aging.…”

Section: Introductionmentioning

confidence: 99%

“…Besides, they obtained the activation energy of the interfacial IMC. Hu et al [23,24] further studied the relationships between the interfacial IMC and the fracture behavior of the Sn-3.0Ag-0.5Cu/Cu solder joints during isothermal aging. Nishikawa and Iwata [25] compared the reflow soldering and laser soldering and found that the growth of the interfacial IMC layer was slower by reflow soldering at the isothermal aging temperature 423 K. However, because of the slow reaction rate of the interfacial movement during isothermal aging, it is difficult to precisely measure the interfacial movement.…”

Section: Introductionmentioning

confidence: 99%

“…Nishikawa and Iwata [25] compared the reflow soldering and laser soldering and found that the growth of the interfacial IMC layer was slower by reflow soldering at the isothermal aging temperature 423 K. However, because of the slow reaction rate of the interfacial movement during isothermal aging, it is difficult to precisely measure the interfacial movement. To date, most methods used to investigate the growth kinetics and the interfacial movement during isothermal aging have used qualitative and statistical analysis [21][22][23][24][25], which cannot accurately reveal the constituents and growth of the interfacial IMC. Additionally, the relationship between the size and morphology of the interfacial IMC and the fracture mechanism of the solder joints during isothermal aging is not well understood.…”

Section: Introductionmentioning

confidence: 99%

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Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Zhao

Zhang

et al. 2020

Materials

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Dynamic observation of the microstructure evolution of Sn2.5Ag0.7Cu0.1RE/Cu solder joints and the relationship between the interfacial intermetallic compound (IMC) and the mechanical properties of the solder joints were investigated during isothermal aging. The results showed that the original single scallop-type Cu6Sn5 IMC gradually evolved into a planar double-layer IMC consisting of Cu6Sn5 and Cu3Sn IMCs with isothermal aging. In particular, the Cu3Sn IMC grew towards the Cu substrate and the solder seam sides; growth toward the Cu substrate side was dominant during the isothermal aging process. The growth of Cu3Sn IMC depended on the accumulated time at a certain temperature, where the growth rate of Cu3Sn was higher than that of Cu6Sn5. Additionally, the growth of the interfacial IMC was mainly controlled by bulk diffusion mechanism, where the activation energies of Cu6Sn5 and Cu3Sn were 74.7 and 86.6 kJ/mol, respectively. The growth rate of Cu3Sn was slightly faster than that of Cu6Sn5 during isothermal aging. With increasing isothermal aging time, the shear strength of the solder joints decreased and showed a linear relationship with the thickness of Cu3Sn. The fracture mechanism of the solder joints changed from ductile fracture to brittle fracture, and the fracture pathway transferred from the solder seam to the interfacial IMC layer.

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“…As a result, the Sn-Ag-Cu (SAC) solder is developed as an alternative solder alloy. is solder alloy with different compositions has found wide acceptance in the industry owing to the amalgamation of good solder properties accompanied by reasonably decent mechanical properties [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

Sonawane

Raja

Gupta

2020

Advances in Materials Science and Engineering

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In this study, “Concentrated Solar Energy (CSE)” is applied for soldering and is named as the “Concentrated Solar Energy Soldering (CSES) technique.” Lead-free solders are used for comparing novel CSES technique solder joints with CSI (Conventional Soldering Iron) solder joints. Tensile strength, bending/flexural strength, microhardness, electrical resistivity, fractography, optical microstructures, SEM microstructures, and EDS analysis were used to compare CSES solder joints with CSI solder joints. The salt spray test (SST) was used for corrosion analysis of CSES and CSI solder joints. Experimental results reveal that the tensile response, bending strength, and microhardness of the CSES solder joints were almost equal to those of the CSI solder joints. It was observed that after corrosion, the tensile strength, bending strength, and microhardness for CSES and CSI solder joints reduced. CSES solder joints were found to be slightly better than CSI solder joints for electrical resistivity. Electrical resistivity for all the cases studied was found to increase slightly after corrosion. Interfacial integrity and effect of corrosion were clearly observed on CSES and CSI solder joint microstructures. The intermetallic compounds (IMC) formed in case of CSES solder joints were found to be having slightly less thickness than that of CSI solder joints. The results demonstrate CSES technique as a green technology and a potential substitute to the CSI method.

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Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

Cited by 130 publications

References 37 publications

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

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