Microstructure evolution and mechanical properties of Al/Cu ultrasonic spot welded joints during thermal processing

Ao, Sansan; Li, Chunjie; Zhang, Wei; Wu, Manpeng; Dai, Yu; Chen, Yao; Luo, Zhen

doi:10.1016/j.jmapro.2019.04.006

Cited by 30 publications

(3 citation statements)

References 21 publications

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“…In this regard, the choice of the appropriate technology is very important. The butt joints of copper and aluminum obtained by laser welding [4,10] and friction stir welding [11][12][13][14] have been reported, in addition to the use of other technologies for joining thin sheets-explosive welding [15], laser brazing [16], laser spot welding [17], friction stir spot welding [18,19], ultrasonic welding [20][21][22], etc.…”

Section: Introductionmentioning

confidence: 99%

Electron-Beam Welding Cu and Al6082T6 Aluminum Alloys with Circular Beam Oscillations

et al. 2022

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In this study, we present the results from electron-beam welding operations applied on copper and Al6082T6 aluminum alloys. The influence of beam-scanning geometries on the structure and mechanical properties of the welded joint is studied. The experiments were conducted using a circle oscillation mode with an oscillation radius of 0.1 mm and 0.2 mm. The beam deflection was set to 0.4 mm with respect to the side of the aluminum alloy, and the beam power was set at 2700 W. The phase composition of the obtained welded joints was studied by X-ray diffraction (XRD). Scanning electron microscopy (SEM) was used for the investigation of the microstructure of the joints. The chemical composition was investigated by using energy-dispersive X-ray spectroscopy (EDX). The mechanical properties were studied by micro-hardness investigations. The fusion zone of the weld seam contains three phases—an aluminum matrix, an ordered solid solution of copper and aluminum in the form of CuAl2, and pure copper. Electron beam-scanning geometries have significant influences on the structure of the weld. Increasing the beam oscillation’s radius leads to a decrease in intermetallic phases and improves homogeneity. The measured microhardness values in the fusion zone are much higher than the ones measured in the base metals due to the formation of intermetallic phases. The microhardness of the weld joint formed using an oscillation radius of 0.2 mm was much lower compared to the one formed using an oscillation radius of 0.1 mm.

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Section: Introductionmentioning

confidence: 99%

Electron-Beam Welding Cu and Al6082T6 Aluminum Alloys with Circular Beam Oscillations

et al. 2022

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“…Because of the large melting temperature difference between copper and aluminium, using the common fusion soldering method, it is difficult to solder Cu/Al joints. At present, Cu/Al joints are generally soldered by explosive soldering (Khanzaneh et al , 2018; Athar and Tolaminejad, 2015), ultrasonic-assisted spot soldering (Fujii et al , 2018; Ao et al , 2019; Dhara and Das, 2020; Pati et al , 2020), electromagnetic pulse soldering (Raoelison et al , 2015; Nirina et al , 2014), laser soldering (Kermanidis et al , 2018; Schmalen and Plapper, 2016), friction stir soldering (Muhammad et al , 2019; Yan and Shi, 2020; Hou et al , 2020; Fei et al , 2018) and other soldering methods. Because of complex equipment, high production costs and long production cycles, the use of these methods has been limited.…”

Section: Introductionmentioning

confidence: 99%

Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

Gan

Chen

Jiang

et al. 2023

SSMT

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Purpose This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted. Design/methodology/approach A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the joint and successfully achieved micro-joining of Cu/Al under ultrasonic-assisted. Findings The results indicated that when the bonding temperature was 180°C, there was only one layer of CuZn5 intermetallic compounds (IMCs) at the Cu interface. However, when the bonding temperature was 190°C, 200°C and 210°C, the Cu interface IMCs had two layers: for one layer, the IMCs near the Cu substrate were Cu5Zn8 and for another layer, the IMCs near the solder were CuZn5. In addition, the thickness of the Cu interfacial IMCs increased with the bonding temperature. In particular, the thickness of IMCs at the Cu interface of the Cu/Al joints soldered at 210°C was 4.6 µm, which increased by 139.6% compared with that of the Cu/Al joints soldered at 180°C. However, there was no IMC layer at the Al interface, but there might be a Zn–Al solid solution layer. The shear strength of Cu/Al joints soldered at 180°C was only 15.01 MPa, but as the soldering temperature continued to increase, the shear strength of the Cu/Al joints increased rapidly. When the soldering temperature was 200°C, the shear strength of the Cu/Al joints reached the maximum of 38.07 MPa, which was 153.6% higher than that at 180°C. When the soldering temperature was 180°C, the fracture of Cu/Al joints was mainly on the Al side. However, when soldering temperature was 190°C, 200°C and 210°C, the fracture of Cu/Al joints was mainly broken in the Zn particles layer. Originality/value A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the Cu/Al joint at 210°C.

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“…One of the benefits of the solid-state welding of Cu to Al is that it can reduce the formation and growth of interfacial IMCs by introducing severely plastic deformation and then reducing welding temperature and time. The main solid-state welding processes are friction welding [9]- [11], ultrasonic welding [12], explosive welding [13], cold roll welding [14], and diffusion bonding or diffusion welding [15]- [17], which is a solid-state welding process used for joining similar and dissimilar metals. This process is based on the principle of solid-state diffusion, wherein the atoms of two solids metallic surfaces intersperse themselves over time [18].…”

Section: Introductionmentioning

confidence: 99%

Solid-State Diffusion Welding of Commercial Aluminum Alloy with Pure Copper

Bedjaoui

Boumerzoug

Delaunois

2022

Int. J. Automot. Mech. Eng.

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The aim of this investigation is to study the effect of time and temperature on the solid-state diffusion welding of commercial aluminum alloy 2xxx series with a pure copper at 425°C, 475°C, 500°C, and 525°C during holding times from 15 min to 240 min. The main characterization techniques were optical microscopy, scanning electron microscopy, energy dispersive spectrometry, nanoindentation, microhardness measurements, and x-ray diffraction. Results showed that increasing the temperature and the holding time had an effect on the apparition of the intermetallics at the Al alloy/Cu interface. Five intermetallic phases namely Al2Cu, AlCu, Al3Cu4, Al2Cu3, and Al4Cu9 were identified at the interface. The mechanical properties of the welded joint Al/Cu alloy varied also with the time and temperature. The nanoindentation measurements showed that the highest values of hardness were recorded in AlCu and Al3Cu4 phases. The welding success of these dissimilar metals can be used for battery cables or to form heat exchanger plates for vehicles.

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Microstructure evolution and mechanical properties of Al/Cu ultrasonic spot welded joints during thermal processing

Cited by 30 publications

References 21 publications

Electron-Beam Welding Cu and Al6082T6 Aluminum Alloys with Circular Beam Oscillations

Electron-Beam Welding Cu and Al6082T6 Aluminum Alloys with Circular Beam Oscillations

Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

Solid-State Diffusion Welding of Commercial Aluminum Alloy with Pure Copper

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