Abstract:Purpose
This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted.
Design/methodology/approach
A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the joint and successfully achieved micro-joining of Cu/Al under ultrasonic-assisted.
Findings
The results indicated that when the bonding temperature was 180°C, there was only one layer of CuZn5 intermetallic compou… Show more
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