Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires

Hsueh, Hao Wen; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Lihui

doi:10.1016/j.microrel.2011.07.062

Cited by 21 publications

(9 citation statements)

References 14 publications

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“…10b) while the HAZ lengths were 220 lm and 180 lm, respectively. It should be noted that the grain growth of the annealed Ag-2Pd wire (275°C) was affected by the annealing process resulting in a shorter HAZ length [12]. wire was not obvious.…”

Section: Fab/haz Of Annealed Ag-2pd Wirementioning

confidence: 99%

Effect of annealing on the microstructure and bonding interface properties of Ag–2Pd alloy wire

Tseng

Hung

Lui

et al. 2015

Microelectronics Reliability

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Section: Fab/haz Of Annealed Ag-2pd Wirementioning

confidence: 99%

Effect of annealing on the microstructure and bonding interface properties of Ag–2Pd alloy wire

Tseng

Hung

Lui

et al. 2015

Microelectronics Reliability

Self Cite

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“…Ag bonding wire attracts the attention of scholars because of its excellent electrical and thermal conductivity and lower price than Au. Also, Ag is one of the materials with the most potential to adapt to the development trend of microelectronic packaging with high integration, high density, and high speed, that is considered a promising bonding material for application in the packaging market [ 19 , 20 ]. But there still exists some reliability issues of Ag bonding wire to be solved, so it has not obtained widespread application yet [ 21 ].…”

Section: Introductionmentioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

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“…In general, Au wires ball welding is produced by the electric-flame-off (EFO) system, which generates high-voltage discharge to the tail wire and generates electric sparks. The high temperature generated instantly melts the tail end of the gold wire to produce a free air ball (FAB) [ 16 , 17 ]. Later, the ultrasonic power source generates mechanical vibration energy, which causes deformation between the gold ball and the pad, resulting in mutual diffusion of metal atoms.…”

Section: Introductionmentioning

confidence: 99%

Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment

Wang

Liu

et al. 2022

Micromachines

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The long-term application of sensors in a high-temperature environment needs to address several challenges, such as stability at high temperatures for a long time, better wiring interconnection of sensors, and reliable and steady connection of the sensor and its external equipment. In order to systematically investigate the reliability of thin coatings at high temperatures for a long time, Au and Cr layers were deposited on silicon substrates by magnetron sputtering. Additionally, samples with different electrode thicknesses were annealed at different temperatures for a varied duration to study the effect of electrode thickness, temperature, and duration on the reliability of samples. The results of tensile and probe tests before and after heat treatment revealed that the mechanical strength and electrical properties have changed after annealing. In addition, the bonding interface was analyzed by a cross-sectional electron microscope. The analysis showed that long-term continuous high-temperature exposure would result in thinning of the electrode, formation of pores, recrystallization, and grain growth, all of which can affect the mechanical strength and electrical properties. In addition, it was observed that increasing the thickness of the gold layer will improve reliability, and the test results show that although the thin metal layer sample is in poor condition, it is still usable. The present study provides theoretical support for the application of thin coatings in high temperatures and harsh environments.

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Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires

Cited by 21 publications

References 14 publications

Effect of annealing on the microstructure and bonding interface properties of Ag–2Pd alloy wire

Effect of annealing on the microstructure and bonding interface properties of Ag–2Pd alloy wire

Research Progress on Bonding Wire for Microelectronic Packaging

Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment

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