Microstructure, dynamic restoration and recrystallization texture of Sn-Cu after rolling at room temperature

Liu, Guangyu; Ji, Shouxun

doi:10.1016/j.matchar.2019.02.032

Cited by 13 publications

(5 citation statements)

References 39 publications

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“…This high density dislocation will accumulated at the grain boundary and act as nucleation site to form low-angle grain boundary (LAGB) or subgrain [22]. Further increase of temperature up to 150°C has led to subgrain transform into high-angle grain boundary (HAGB) or new recrystallize grain [23]. The formation of new recrystallize grain have resulted grain refinement which increase the hardness of Sn-Cu solder alloy up to 114.34 MPa.…”

Section: Resultsmentioning

confidence: 99%

Influence of Thermomechanical Processing on Micromechanical Properties of SN-0.7CU Solder Alloy via Nanoindentation Approach

Mohd Yusoff,

Jalar

2022

Jurnal Teknologi

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Sn-based solder alloys are commonly utilized in electronic packages as an interconnection. In this study, nanoindentation was used to explore the impact of thermomechanical processing on the micromechanical characteristics of Sn-0.7Cu solder alloy. Bar-shaped Sn-0.7Cu solder alloy was cut into 9 cubic-shaped samples with dimension of 6 mm (l) X 6 mm (w) X 10 mm (h). First, cubic-shaped Sn-0.7Cu solder alloys was heat-treated for 20 minutes at temperatures of 30°C, 90°C, and 150°C, followed by compression until the thickness reduced to 40% and 80% and quick quench in water medium. As a control, solder alloys without compression process are employed. The result shows that thermomechanical-processed samples with 80% thickness reduction have the least hardness changes along temperature increment. These values were 6.46 MPa (from 30℃ to 90℃) and 23.73 MPa (from 90℃ to 150℃), respectively. The smaller gap of values when temperature increased were obtained through formation of new recrystallize grains which also referred as grain refinemet. The reduced modulus for thermomehanical-procesed sample with 80% thickness reduction sample also showed the same trend as the hardness value. The value dropped from 56.22 GPa to 42.12 GPa before rising slightly to 48 GPa as the temperature increased. The change of reduced modulus values were lower when compared to control and thermomechanical-processed sample with 40% thickness reduction samples. The findings demonstrate that as the temperature rises, thermomechanical processing with an 80% thickness reduction stabilizes the micromechanical properties of the Sn-0.7Cu solder alloy.

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Section: Resultsmentioning

confidence: 99%

Influence of Thermomechanical Processing on Micromechanical Properties of SN-0.7CU Solder Alloy via Nanoindentation Approach

Mohd Yusoff,

Jalar

2022

Jurnal Teknologi

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“…where E represents energy produced by the orientation change, k B is the Boltzmann parameter and T is the simulation temperature. The range energy of matrix grains was planned by mesoscale GG simulations using misorientation and inclination factors reported for Sn alloys [51][52][53] as well as Read-Schockley [54] model and dislocation spacing in low angle boundaries [55].…”

Section: Energy Balance During Aggmentioning

confidence: 99%

A computational approach to restoration phenomena during annealing of rolled Cu-2Be: recrystallization, grain growth and abnormal grain growth

Kalaki

Vafaeenezhad²,

Mirahmadi

et al. 2023

Modelling Simul. Mater. Sci. Eng.

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In this study, an integrated paradigm was developed for the simulation of static recrystallization (SRX) after cold rolling of a Cu-2Be alloy. The proposed framework also models with the normal and abnormal grain growth of the after transient recrystallization through post-rolling annealing when stored and interfacial energies are varying. The simulation of AGG was done to study the influence of precipitates and sub-boundaries. The initial stored energy as a result of deformation was calculated. The finite element analysis (FEA) was used to compute the heterogeneous distribution of stored energy due to heterogeneous deformation and is then incorporated to Monte Carlo (MC) algorithm to attain SRX grain size and kinetics. The stored energy assigned to the as-rolled grain micrograph is introduced to the MC simulation as the initial condition considering the size-scale of the calculation domain. The effects of the Zener drag pressure stemming from the presence of second phase particles on the recrystallization progress was also incorporated into the MC model. To evaluate the simulation predictions, the numerical results of the SRX fractions and grain sizes after cold rolling was studied and compared to the experimental ones, and a reasonable accordance is achieved. The numerical results presented that precipitates and sub-boundaries in cooperation take a significant role in persuading AGG by wetting alongside triple junctions. To validate the quantitative results, SRX transformation kinetics has been investigated using the differential scanning calorimetry (DSC).

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“…Cu-Sn alloy can be effectively used as a cladding material in explosives due to its good workability and the property of absorption of small thermal neutrons in a highly radiative environment. Liu et al [ 28 ] incorporated electron backscatter diffraction (EBSD) technique to research the microstructure, dynamic restoration, and grain boundary, twinning, and recrystallization texture of Sn-0.5 wt% Cu alloy. After rolling at a moderate strain rate, the alloy showed a bimodal grain structure comprised of 97% fine grains (less than 30 µm in size) and 3% coarse grains (with 50–150 µm in size).…”

Section: Processes Conducted On Cu-sn Alloymentioning

confidence: 99%

“…{3 0 1} and {1 0 1} twins were observed as two additional mechanisms for effective deformation. In addition, the results of the paper by Liu et al [ 28 ] proved that the deformation mechanism initiated by the PSN mechanism leads to the formation of <0 0 1>//RD oriented nuclei. Moreover, a necklace type of structure was also found along the boundary due to continuous dynamic recrystallization (CDRX).…”

Section: Processes Conducted On Cu-sn Alloymentioning

confidence: 99%

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Titanium in Cast Cu-Sn Alloys—A Review

et al. 2021

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The article reviews the progress made on bronze alloys processed through various casting techniques, and focuses on enhancements in the microstructural characteristics, hardness, tensile properties, and tribological behaviour of Cu-Sn and Cu-Sn-Ti alloys. Copper and its alloys have found several applications in the fields of automobiles, marine and machine tools specifically for propellers in submarines, bearings, and bushings. It has also been reported that bronze alloys are especially used as an anti-wear and friction-reducing material to make high performance bearings for roller cone cock bits and warships for defence purposes. In these applications, properties like tensile strength, yield strength, fatigue strength, elongation, hardness, impact strength, wear resistance, and corrosion resistance are very important; however, these bronze alloys possess only moderate hardness, which results in low wear resistance, thereby limiting the application of these alloys in the automobile industry. The major factor that influences the properties of bronze alloys is the microstructure. Morphological changes in these bronze alloys are achieved through different manufacturing techniques, such as casting, heat treatment, and alloy addition, which enhance the mechanical, tribological, and corrosion characteristics. Alloying of Ti to cast Cu-Sn is very effective in changing the microstructure of bronze alloys. Reinforcing the bronze matrix with several ceramic particles and surface modifications also improves the properties of bronze alloys. The present article reviews the techniques involved in changing the microstructure and enhancing the mechanical and tribological behaviours of cast Cu-Sn and Cu-Sn-Ti alloys. Moreover, this article also reviews the industrial applications and future scope of these cast alloys in the automobile and marine industries.

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Microstructure, dynamic restoration and recrystallization texture of Sn-Cu after rolling at room temperature

Cited by 13 publications

References 39 publications

Influence of Thermomechanical Processing on Micromechanical Properties of SN-0.7CU Solder Alloy via Nanoindentation Approach

Influence of Thermomechanical Processing on Micromechanical Properties of SN-0.7CU Solder Alloy via Nanoindentation Approach

A computational approach to restoration phenomena during annealing of rolled Cu-2Be: recrystallization, grain growth and abnormal grain growth

Titanium in Cast Cu-Sn Alloys—A Review

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