Microstructure development during transient liquid phase bonding of GTD-111 nickel-based superalloy

Pouranvari, M.; Ekrami, A.; Kokabi, A.H.

doi:10.1016/j.jallcom.2007.07.108

Cited by 110 publications

(45 citation statements)

References 23 publications

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“…[10][11][12] The study of the tribological behavior of materials can bring important contributions to fuel consumption reduction and to damage prevention during the service of components and equipment. [13] Although many studies correlating the structure of materials to wear resistance can be found in the open literature, information about the influence of the dendritic network on the tribological behavior of metallic alloys is rarely found. Rao et al [14] state that the strain-hardening tendency of Al-Si alloys depends on the DAS and that the size of the eutectic silicon governs the wear behavior of these alloys.…”

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Dendritic Arm Spacing Affecting Mechanical Properties and Wear Behavior of Al-Sn and Al-Si Alloys Directionally Solidified under Unsteady-State Conditions

Cruz

Meza

Fernandes

et al. 2010

Metall Mater Trans A

102

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Alloys of Al-Sn and Al-Si are widely used in tribological applications such as cylinder liners and journal bearings. Studies of the influence of the as-cast microstructures of these alloys on the final mechanical properties and wear resistance can be very useful for planning solidification conditions in order to permit a desired level of final properties to be achieved. The aim of the present study was to contribute to a better understanding about the relationship between the scale of the dendritic network and the corresponding mechanical properties and wear behavior. The Al-Sn (15 and 20 wt pct Sn) and Al-Si (3 and 5 wt pct Si) alloys were directionally solidified under unsteady-state heat flow conditions in water-cooled molds in order to permit samples with a wide range of dendritic spacings to be obtained. These samples were subjected to tensile and wear tests, and experimental quantitative expressions correlating the ultimate tensile strength (UTS), yield tensile strength, elongation, and wear volume to the primary dendritic arm spacing (DAS) have been determined. The wear resistance was shown to be significantly affected by the scale of primary dendrite arm spacing. For Al-Si alloys, the refinement of the dendritic array improved the wear resistance, while for the Al-Sn alloys, an opposite effect was observed, i.e., the increase in primary dendrite arm spacing improved the wear resistance. The effect of inverse segregation, which is observed for Al-Sn alloys, on the wear resistance is also discussed.

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confidence: 99%

Dendritic Arm Spacing Affecting Mechanical Properties and Wear Behavior of Al-Sn and Al-Si Alloys Directionally Solidified under Unsteady-State Conditions

Cruz

Meza

Fernandes

et al. 2010

Metall Mater Trans A

102

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“…The ejection of B into adjacent melt because of low solubility of B in Ni (0.3 at. pct [15,[21][22][23][24][25][26][27] presented in Table IV) and the partition coefficient of B in Ni (~0.008, based on the Ni-B binary phase diagram [22,27] ) shifts the melt composition toward the eutectic composition. The enrichment of B and the formation of Ni 3 B lead to an increase in B concentration in the ASZ.…”

Section: Resultsmentioning

confidence: 99%

“…pct). [15,[21][22][23][24][25][26][27] Thus, at the higher bonding temperature used in the present work, on the one hand, the solubility of the melting point depressant B in the ISZ is decreased (i.e., C aL is decreased), as shown in Figure 18(b), owing to more diffusion of the base alloying elements, particularly Fe, from the substrate into the interlayer. In addition, according to the Ni-B phase diagram, an increase in bonding temperature above the eutectic temperature simultaneously reduces the solubility of B in Ni.…”

Section: B No Bn Precipitates In the Bonding-affected Zonementioning

confidence: 96%

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Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials

Yuan

Kim

Kang

2010

Metall Mater Trans A

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Microstructural evolution and bonding behavior of transient liquid-phase (TLP) bonded joint for a duplex stainless steel using MBF-30 (Ni-4.5Si-3.2B [wt pct]) and MBF-50 (Ni-7.5Si-1.4B-18.5Cr [wt pct]) were investigated. Using MBF-30, the microstructure of the athermally solidified zone was dependent on B diffusion at 1333.15 K (1060°C). Ni 3 B and a supersaturated c-Ni phase were observed in this zone. BN appeared in the bonding-affected zone. However, using MBF-50, the influences of base metal alloying elements, particularly N and Cr as well as Si in the filler material, on the bond microstructure development were more pronounced at 1448.15 K (1175°C). BN and (Cr, Ni) 3 Si phase were present in the bond centerline. The formation of BN precipitates in the bonding-affected zone was suppressed. A significant deviation in the isothermal solidification rate from the conventional TLP bonding diffusion models was observed in the joints prepared at 1448.15 K (1175°C) using MBF-50.

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“…In fact, in some cases the bond area becomes indistinguishable from other grain boundaries [18,35,37,68,108,109,130,185] due to significant diffusion at high temperature. Such bonds are often as strong as the bulk substrate material [14,164], or stronger, causing the joined assembly to fail in the substrate material rather than in the bond [14,31,71,76].…”

Section: Advantages and Disadvantages Of Tlp Bondingmentioning

confidence: 99%

Overview of transient liquid phase and partial transient liquid phase bonding

2011

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Transient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the substrate materials, causing isothermal solidification. The result of this process is a bond that has a higher melting point than the bonding temperature. This bonding process has found many applications, most notably the joining and repair of Ni-based superalloy components. This article reviews important aspects of TLP bonding, such as kinetics of the process, experimental details (bonding time, interlayer thickness and format, and optimal bonding temperature), and advantages and disadvantages of the process. A wide range of materials that TLP bonding has been applied to is also presented. Partial transient liquid phase (PTLP) bonding is a variant of TLP bonding that is typically used to join ceramics. PTLP bonding requires an interlayer composed of multiple layers; the most common bond setup consists of a thick refractory core sandwiched by thin, lower-melting layers on each side. This article explains how the experimental details and bonding kinetics of PTLP bonding differ from TLP bonding. Also, a range of materials that have been joined by PTLP bonding is presented.

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Microstructure development during transient liquid phase bonding of GTD-111 nickel-based superalloy

Cited by 110 publications

References 23 publications

Dendritic Arm Spacing Affecting Mechanical Properties and Wear Behavior of Al-Sn and Al-Si Alloys Directionally Solidified under Unsteady-State Conditions

Dendritic Arm Spacing Affecting Mechanical Properties and Wear Behavior of Al-Sn and Al-Si Alloys Directionally Solidified under Unsteady-State Conditions

Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials

Overview of transient liquid phase and partial transient liquid phase bonding

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