Microstructure and shear strength on ultrasonic-assisted soldered the Si/Cu joint using Sn-3.5Ag solder

Ding, Zhijie; Xue, Haitao; Guo, Weibing; Chen, Cuixin; Jia, Yang

doi:10.1016/j.mtcomm.2022.104451

Cited by 2 publications

(1 citation statement)

References 41 publications

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“…High power, small volume has gradually become the development trend of electronic components. [1][2] As the new generation of semiconductor component, insulated gate bipolar transistor (IGBT) is widely used in high-speed trains, new energy systems with a series of advantages. [3][4][5] Ceramic clad copper has become the first choice of ceramic lining plate in IGBT module packaging.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni foam on the microstructure and properties of AlN ceramic/Cu brazed joint

Guo

Ding

et al. 2023

Int J Applied Ceramic Tech

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Aluminum nitride (AlN) ceramics and oxygen‐free Cu were brazed with multilayer filler consisted of Ag‐Cu‐Ti +Ni foam. The microstructure and forming principle of AlN/Cu joints were studied and the influence of Ni foam on the joints was focused. The result shows that the composition of AlN/Cu joint was AlN/TiN/Ni3Ti+Cu(s,s)+CuTi+Ni foam+Ag(s,s)/Cu. The joint strength was only 66.7 ± 3.7MPa with pure Ag‐Cu‐Ti solder and the fracture occurred inside AlN ceramics due to the residual stress. The foam nickel reacted with Ag‐Cu‐Ti filler metal to form Ni3Ti during brazing process. Ni foam still retained the basic skeleton structure during brazing, and the mechanical capacity of AlN/Cu joint was enhanced significantly. The maximum shear strength of the brazed joint can reach 89.6 ± 4.5 MPa with .1 mm Ni foam, and the fracture position changed to the brazing filler. The result shows that nickel foam can reduce the residual thermal stress, and the mechanical properties of AlN/Cu joints were improved.

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