Interfacial bonding mechanisms in ultrasonic-assisted soldered Si/Cu joint using Sn-3.5Ag-4Al solder

Li, Wenzhao; Ding, Zhijie; Xue, Haitao; Guo, Weibing; Chen, Cuixin; Jia, Yang; Zheng, Weitao

doi:10.1016/j.matchar.2023.112833

Cited by 9 publications

(2 citation statements)

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“…The total energy consumed by microwave soldering can be calculated only for the process itself, taking into consideration that the preparation of samples, in terms of mechanical cutting and deposition of solder layers, is similar to manual soldering. Therefore, the total energy consumed can be assessed using Equation (7):…”

Section: Economical Sustainability Of the Microwave Soldering Processmentioning

confidence: 99%

“…Manual soldering involves heating the solder material with a soldering iron and applying it to the joint between the base materials. Ultrasonic-assisted soldering of dissimilar materials has been reported by Li et al They successfully obtained Si/Cu joints using Sn-3.5Ag-4Al solder [7]. Wave soldering involves passing the copper plates through a bath of molten solder material.…”

Section: Introductionmentioning

confidence: 99%

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Microwave Soldering of Low-Resistance Conductive Joints—Technical and Economic Aspects

et al. 2023

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Soldering processes are applied in the fabrication of electronic circuits used in most modern domestic and industrial technologies. This article aims to introduce a new soldering technology based on the microwave joining of copper materials used in electronic applications. The study was focused on microwave technology used as the thermal source for soldering. A simulation model of temperature distributions in copper plates with overall dimensions of 50 × 10 × 0.8 mm was developed in order to determine the necessary microwave power for soldering. For 270 °C simulated on the surface of copper plates, the microwave-injected power was determined to be 598.89 W. An experimental program for 600, 650, 700, and 750 W was set in order to achieve soldering of copper plates in less than 1 min. Soldered copper plates were subject to electrical resistance measurements being obtained with variations up to ±1.5% of the initial electrical resistance of the base materials. The quality of joints has also been analyzed through microscopy after the soldering process. In addition, mechanical properties were determined using a universal testing machine. The results have shown similar behavior of the samples layered with SAC on the one-side and double-side but also a significantly lower force before breaking for one-side-layered samples. An economic analysis was performed and the results obtained have shown that in terms of energy efficiency and total costs for microwave soldering compared with manual soldering, microwave soldering is cost-effective for industrial processing.

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Section: Economical Sustainability Of the Microwave Soldering Processmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%