2004
DOI: 10.1016/j.msea.2004.05.049
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Microstructure and room temperature hardening of ultra-fine-grained oxide-dispersion strengthened copper prepared by cryomilling

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Cited by 70 publications
(22 citation statements)
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“…[24] Based on the preceding viewpoint, uniform strain during deformation of UFG materials can be obtained by controlling instability and delaying the necking process. [1,2,24,25] One plausible approach in the attempt to control instability is to obtain UFG structure with bimodal grain size distribution. In this case, the preferential accommodation of strain in large grains will provide a good strength-ductility combination; and second, the bimodal grain size distribution will allow significant strain hardening to take place, curbing localized deformation.…”
Section: Introductionmentioning
confidence: 99%
“…[24] Based on the preceding viewpoint, uniform strain during deformation of UFG materials can be obtained by controlling instability and delaying the necking process. [1,2,24,25] One plausible approach in the attempt to control instability is to obtain UFG structure with bimodal grain size distribution. In this case, the preferential accommodation of strain in large grains will provide a good strength-ductility combination; and second, the bimodal grain size distribution will allow significant strain hardening to take place, curbing localized deformation.…”
Section: Introductionmentioning
confidence: 99%
“…[24] Thus, to obtain high uniform strain during deformation of UFG materials, the strain hardening ability is required as a stabilizing effect to control the instability and to delay/diffuse necking. [1,2,24,25] One approach to control instability is to obtain the UFG structure with a bimodal grain size distribution. First, the preferential accommodation of strain in large grains would lead to a good strength-ductility combination.…”
Section: Introductionmentioning
confidence: 99%
“…For such applications an optimal combination of mechanical strength at room temperature and creep properties at elevated temperatures is desirable. In a preceding paper [4], we have described the manufacturing and microstructural characterization of ultrafine-grained (UFG) copper strengthened by 3 vol.% of nanosized, incoherent yttrium and calcium oxide dispersoids, respectively. While in Ref.…”
Section: Introductionmentioning
confidence: 99%
“…While in Ref. [4], the room temperature compressive properties of the UFG ODS copper was characterized and interpreted in terms of actual models for ambient temperature strengthening, it is the aim of the present contribution to extend the characterization and modelling to the elevated temperature deformation behaviour by utilizing constant compression rate tests in the temperature * Corresponding author. range from 500 • C (0.57T m ) to 700 • C (0.71T m ) at strain rates ranging from 10 −6 to 10 −2 s −1 .…”
Section: Introductionmentioning
confidence: 99%