Microstructure and mechanical properties of Sn–1.0Ag–0.5Cu solder with minor Zn additions

Leong, Yee Mei; Haseeb, A.S.M.A.; Nishikawa, Hiroshi; Mokhtari, Omid

doi:10.1007/s10854-019-01532-5

Cited by 12 publications

(4 citation statements)

References 42 publications

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“…However, the high price of silver has limited the further application of Ag-based brazing alloys [14]. Some alloying elements, such as In, Zn, Sb, Bi, Ni and rare-earth (RE) metals, have been added to Ag-Cu-Sn-based alloys in order to reduce costs and improve the performance of brazing/soldering alloys [15][16][17][18][19][20]. The reported investigations indicated that the addition of In can lower liquidus and solidus temperatures of Ag-Cu-Sn-based alloys and refine the grain to improve the strength of the joints [15,16,21].…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Phase Transition of Ag50.5Cu33.3Sn16.2-xInx Alloys through Experimental Study and Thermodynamic Calculation

Tong

Rong

Wang

2023

Metals

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In this study, the solidified microstructure and phase transition temperatures of Ag50.5Cu33.3Sn16.2-xInx (x = 5.0, 6.6, 8.2, 9.1, 9.9, 10.7, 11.5, 12.3; at.%) alloys were investigated using a scanning electron microscope with energy dispersive spectrometer (SEM-EDS) and differential thermal analysis (DTA). The experimental microstructure of Ag50.5Cu33.3Sn16.2-xInx alloys demonstrates that the phase fraction of Fcc(Ag) phase increased gradually as the addition of In increased, while the phase fraction of Fcc(Cu) phase decreased. Moreover, the liquidus temperatures of Ag50.5Cu33.3Sn16.2-xInx alloys also decrease with increasing In content. In this work, the Ag-Cu-Sn-In quaternary thermodynamic database was ideally extrapolated from the published literature for Ag-Cu-Sn, Ag-Cu-In, Ag-Sn-In and Cu-Sn-In thermodynamic databases. The calculated vertical section of Ag50.5Cu33.3Sn16.2-Ag50.5Cu33.3In16.2 agreed generally with the phase transition temperatures measured in the present experiment. Finally, the solidification behaviors of Ag50.5Cu33.3Sn16.2-xInx as-cast alloys were analyzed by thermodynamic calculation of the Scheil–Gulliver non-equilibrium model. The simulated solidification processes of some Ag50.5Cu33.3Sn16.2-xInx alloys are, in general, consistent with the experimental results in the present work, which would provide a theoretical basis for the design of novel Ag-Cu-Sn-In brazing alloys.

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Section: Introductionmentioning

confidence: 99%

Microstructure and Phase Transition of Ag50.5Cu33.3Sn16.2-xInx Alloys through Experimental Study and Thermodynamic Calculation

Tong

Rong

Wang

2023

Metals

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“…Additionally, Ag-Cu-Sn-based brazing alloys have been used in industrial applications [5,6]. To reduce the costs of the solders and brazing alloys, some alloying elements such as In, Zn, Sb, Bi, Ni and rare earth metals are added to Sn-Ag-Cu alloys and Ag-Cu-Sn-based alloys [7][8][9][10][11][12][13][14][15][16]. The phase equilibria and thermodynamic information of Ag-Cu-Sn-based alloys are essential to understand the role of alloying elements and to design new Sn-Ag-Cu-based lead-free solders and Ag-Cu-Sn-based brazing alloys [17].…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic Modeling of the Ag-Cu-Sn Ternary System

Tong

Rong

et al. 2022

Metals

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In this work, combined with previous assessments of the Ag-Cu, Ag-Sn and Cu-Sn binary systems, thermodynamic modeling of the Ag-Cu-Sn ternary system was performed using the CALPHAD method using the reported phase diagram data and thermodynamic data. The solution phases including Liquid, fcc, bcc, hcp, bct(Sn) and diamond(Sn) were modeled as substitutional solutions and their excess Gibbs energies were expressed by the Redlich–Kister–Muggianu polynomial. The solubility of the third element in binary intermetallic compounds was not taken into account due to the fact that ternary solubilities for most of the binary compounds are not significant. Thermodynamic properties of liquid alloys, liquidus projection, several vertical sections and isothermal sections were calculated, which were in reasonable agreement with the reported experimental data. Finally, a set of self-consistent thermodynamic parameters formulating the Gibbs energies of various phases in the Ag-Cu-Sn ternary system was obtained.

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“…Numerous studies showed that the IMC of soldering joints was an important factor affecting the reliability of the joint [5][6][7]. Due to the inherent brittleness of intermetallic compound, the interfacial IMC layer type, distribution of elements and the non-uniformity of the coefficient of thermal expansion along the region imposing some problems, such as stress and thermal shock cracking, fatigue performance degradation significantly affect lead-free solder interconnect reliability [8][9][10], so the morphology, size, distribution, heterogeneity of the IMC grains will inevitably affect the reliability of solder joints and packaging. Yang [11] found that prismatic grain had a strong inhibition effect on dislocation motion and crack propagation and the crack was more difficulties to split protruding prismatic grains than to extend on the scallop-shaped grains, when the crack needed to extend.…”

Section: Introductionmentioning

confidence: 99%

Effect of the degree of supercooling on growth mechanism of Cu6Sn5 in pure Sn/Cu solder joint

Guo

Kunwar

et al. 2021

J Mater Sci: Mater Electron

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The growth mechanism of Cu6Sn5 intermetallic compound (IMC) at Sn/Cu interface reflowed under 250 ℃, 275 ℃, and 300 ℃ for a duration of 60s and undergoing highly pressurized air action(HP), water cooling(WC), air cooling(AC) or furnace cooling(FC) in the aftermath has been outlined. In addition, synchrotron radiation imaging technique has been utilized to in-situ observe interfacial Cu6Sn5 grains growth. It has been revealed that the morphologies of Cu6Sn5 grains under HP and AC are both scalloplike, whereas the samples processed with HP and FC bear plane structure and prismatic morphologies.These revelations indicate the secondary growth of Cu6Sn5 grains during the cooling stage as the significant determinant of the final IMC morphology. Thus, continuous growth on the rough surface (M1), spiral dislocation growth (M2), and 2D nucleation and growth (M3), have been proposed to explain the 2 observed morphologies of interfacial Cu6Sn5 grains. M1 has been recognized as the principal mechanism responsible for IMC morphology undergoing water cooling, whereas combination of M1 and M2 decide the morphological feature of interface resulting from air cooling. Finally, all of the three mechanisms (M1, M2 and M3) account for the IMC morphology corresponding to furnace cooling. As all of these three growth mechanisms are affected by the degree of supercooling (ΔT), it is inferred that the ΔT can influence the secondary nucleation of IMC at the cooling stage. With the fact that the homogeneous nucleation occurs at larger ΔT, and the relative favorability for heterogeneous nucleation at smaller ΔT; the growth mechanisms can be mapped with the degree of undercooling. Consequently, the IMC growth mechanisms proposed and their association with ΔT, can be used to obtain an appropriate thickness and morphology of IMC to improve the reliability of solder joints.

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Microstructure and mechanical properties of Sn–1.0Ag–0.5Cu solder with minor Zn additions

Cited by 12 publications

References 42 publications

Microstructure and Phase Transition of Ag50.5Cu33.3Sn16.2-xInx Alloys through Experimental Study and Thermodynamic Calculation

Microstructure and Phase Transition of Ag50.5Cu33.3Sn16.2-xInx Alloys through Experimental Study and Thermodynamic Calculation

Thermodynamic Modeling of the Ag-Cu-Sn Ternary System

Effect of the degree of supercooling on growth mechanism of Cu6Sn5 in pure Sn/Cu solder joint

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