Microstructure and mechanical properties of indium–bismuth alloys for low melting-temperature solder

A liquid metal-based process for tuning the thermoelectric properties of bismuth indium systems

“…2 Bi-In binary system phase diagram (adapted with permission from the paper). 56 Black stars are the concentrations of the Bi-In samples used in this paper. The regions filled with a pink colour correspond to the Bi-In ratios used in this study.…”

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

“…Cu (In, Sn) 2 layers grow and consume Cu 2 (In, Sn) layers continuously because the diffusion rate of In and Sn atoms is higher than that of Cu atoms after aging at 40 °C. Jin et al [52] studied the relationship between the microstructure of In-Bi solder and its composition ratio. They found that Bi 3 In 5 was only detected in In-50Bi alloy solder, BiIn 2 was detected in In-40Bi, In-33.7Bi and In-30Bi, which confirmed that In-Bi binary system contained stable mesophase: Bi 3 In 5 , BiIn 2 and ɛ.…”

“…On the In-Bi-Zn interface of Sn/Cu substrate, Cu 5 Zn 8 phase was better than Cu 6 Sn 5 phase. Jin et al [ 52 ] investigated the relationship between the mechanical properties of In-Bi low temperature solder and its composition. The results showed that the cross-sectional area of the tensile specimen with the increase of In content, showing a high plasticity.…”

EBiIn-Cu-GaIn Composite Electrodes inside Microfluidic Chips

“…For gallium-based metals, their liquid state and flowability make it shine in the field of flexible electronics, but it is easy to squeeze off under pressure resulting in damage to the electrodes. 28 In the case of bismuth-based metals, because it is solid 29 at room temperature, the connection to external wires is very unstable. The metal itself is brittle 29,30 and cannot withstand bending stress and will break easily.…”