Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

Liu, Yang; Li, Shengli; Zhang, Hao; Cai, Hongming; Sun, Fenglian; Zhang, Guoqi

doi:10.1007/s10854-018-9440-2

Cited by 7 publications

(3 citation statements)

References 26 publications

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“…Figure 7(c) showed that the IMC adjacent to the copper substrate was Cu 3 Sn IMC, which was composed of 74.69 At.% Cu and 24.86 At.% Sn. This result is in good agreement with other researchers (Liu et al, 2018;Yan et al, 2009;Sun and Yin, 2019) who reported the presence of similar microstructural phases in Sn-based solder/Cu joints. The thicknesses of the (Cu, Ni) 6 Sn 5 IMC and Cu 3 Sn IMC were about 3 and 4 mm, respectively.…”

Section: Effects Of Alloying Elements On the Wettabilitysupporting

confidence: 93%

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Wang

Sun

Han

et al. 2021

SSMT

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Purpose The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying elements on the wettability. Design/methodology/approach Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before analyzed by scanning electron microscopy. Energy dispersive X-ray spectroscopy was used to identify the composition of the joints. Findings The effects of different soldering processes and alloying elements on the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates were calculated and expounded. The rosin-based flux could effectively remove oxidation layers and improve the wettability of Sn-5Sb-CuNiAg solders. Then with the increase of soldering temperature and time, the contact angles decreased gradually. The soldering processes suited for Sn-5Sb-CuNiAg solders were RMA218, 280°C and 30 s. Considered the effects of alloying elements, the wettability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag was relatively favorable on copper substrates. Besides, Ni could accumulate at the solder/Cu interface and form a jagged (Cu,Ni)6Sn5 IMC. Originality/value This work was carried out with our handmade experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders, and applied extremely to high temperature and frequency working environments of the third-generation semiconductors components, with a greater potential research and development value.

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Section: Effects Of Alloying Elements On the Wettabilitysupporting

confidence: 93%

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Wang

Sun

Han

et al. 2021

SSMT

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“…However, the wettability of SnAgCu-based solder alloys still requires improvement for the the higher requirements of electronic packaging. In addition, the solder joints will deteriorate the reliability under harsh conditions of service, such as mechanical shocks, thermal cycling and electromigration 7 – 9 . Thus, it is necessary to develop a new method to improve the solder quality and the solder joints reliability under halogen-free conditions.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Cui

Zhang

Zhao

et al. 2021

Sci Rep

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Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

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“…In addition, the solder joints will deteriorate the reliability under harsh conditions of service, such as mechanical shocks, thermal cycling and electromigration. [7][8][9] Thus, it is necessary to develop a new method to improve the solder quality and the solder joints reliability under halogen-free conditions. There are two approaches to improve the solder performance and solder joints reliability.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Properties of Ultrasonic Assisted Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joint S Under Thermal Cycling

Cui

Zhang

Zhao

et al. 2021

Preprint

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Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu(x=0, 0.05, 0.1) soldering test and -40~125℃ thermal shock test, the microstructure and mechanical properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS andXRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). The addition of an appropriate amount of Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. Under the condition of 1000 cycles of thermal cycling, the thickness and roughness of IMC of the solder joints with 0.05 wt.% Ni were the smallest, and the shear strength of the solder joints was 19.8 MPa, which was 28.6% higher than that of the solder joints without Ni.The interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni) 6Sn5 and Cu3Sn. In the thermal cycling, the thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, the thickness and roughness of IMC increased obviously, the defects such as microcracks and microvoids began to appear, and the shear strength of the solder joints decreased rapidly.The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile-brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

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Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

Cited by 7 publications

References 26 publications

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Microstructure and Properties of Ultrasonic Assisted Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joint S Under Thermal Cycling

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