Abstract:Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu(x=0, 0.05, 0.1) soldering test and -40~125℃ thermal shock test, the microstructure and mechanical properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS andXRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu so… Show more
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