In this study c pper-silver (CuAg) all y structures with varying Ag c ntent were fabricated using Selective Laser Melting (SLM), Laser P wder Bed Fusi n (L-PBF) Additive Manufacturing (AM). P wder m rph l gy, distributi n and elemental analysis were c nducted using Scanning Electr n Micr sc py (SEM) and dynamic imaging f r CuAg10, CuAg20 and CuAg30 at mised p wder. The resultant p re defect m rph l gy and distributi n f r each as built and annealed CuAg all y structure was investigated and rep rted using X-ray C mputed T m graphy (XCT) and 3D visualisati n. The at mic crystal structure f r each as built and annealed CuAg all y is rep rted thr ugh X-Ray Diffracti n (XRD) analysis. Yield strength, Y ung's M dulus, failure strain and Ultimate Tensile Strength (UTS) f as built and annealed AM CuAg structures are rep rted and sample fracture surfaces are analysed using SEM and Energy Dispersive X-Ray (EDX) techniques. Increased Ag c ntent fr m CuAg10% t CuAg30% is sh wn t decrease the number f p re defects by 87% and 83% f r as built and annealed samples with average p re size decreasing by 40% and 9.5%. H wever, the annealing pr cess was f und t increase the p r sity by up t 164%. Furtherm re, the annealing pr cess resulted in at mic lattice c ntracti ns resulting in increased yield strength, Y ungs M dulus and Ultimate Tensile Strength (UTS) f r CuAg30%.