Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics

Medgyes, Bálint; Horváth, Barbara; Illés, Béla; Shinohara, Tadashi; Tahara, Akira; Harsányi, Gábor; Krammer, Olivér

doi:10.1016/j.corsci.2014.11.004

Cited by 45 publications

(18 citation statements)

References 35 publications

(36 reference statements)

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“…It was found that pure In and In-48Sn solder alloys were immune to ECM in pure water. Medgyes et al 55 used the transmission electron microscopy to detect the composition of dendrites which were formed during the ECM of Sn solder alloys with a low level of Ag. Sb was found in the dendrites, indicating that Sb also took part in the ECM of solder alloy process.…”

Section: Other Elementsmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

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Section: Other Elementsmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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“…The time required to create dendritic bridges, which cause short circuits between two conductive paths, is determined by several factors including relative humidity, temperature, conductor material, conductor spacing, voltage difference, contamination amount, contamination type, etc. [17][18][19].…”

Section: Dendritesmentioning

confidence: 99%

Overview of Selected Issues Related to Soldering

Dusek¹,

Busek²,

Veselý³

2021

Welding - Modern Topics

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The formation of defects and imperfections in the soldering process can have many causes, which primarily include a poorly setup technological process, inappropriate or inappropriately used materials and their combinations, the effect of the surroundings and design errors. This chapter lists some examples of errors that can occur in soldering, while review is devoted to selected defects: non-wettability of the solder pads, dewetting, wrong solder mask design, warpage, head-in-pillow, cracks in the joints, pad cratering, black pad, solder beading, tombstoning, dendrites, voids, flux spattering from the solder paste, popcorning and whiskers.

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“…According to the results, a micro-alloying element (antimony) has participated in the electrochemical processes. The presence of antimony is an unexpected result, since there are no reports about it in the ECM literature [25].…”

Section: Reliability and Quality Of Electronic Assembliesmentioning

confidence: 99%

“…Since the dendrite thickness was at ~100 nm scale, it was found that it could be directly analyzed by TEM without any post sample preparation procedure. The procedure of sample preparation contains four steps; (1) Removing the dendrite by using scotch-tape; (2) Positioning the dendrite onto the Mo micro-grid; (3) Immersing them into toluene for several hours; (4) Pick up the sample from toluene; then the sample is ready for TEM investigation [25]. In Fig.…”

Section: Reliability and Quality Of Electronic Assembliesmentioning

confidence: 99%

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2015

Vajk¹,

Harsányi

Poppe

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

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PrefaceThroughout László Vajta, Dean of BME VIK János Levendovszky, Deputy Dean of BME VIK Department of Automation and Applied InformaticsDepartment of Automation and Applied Informatics (AUT) is one of the largest and dynamically developing departments at BME with diverse scope competences such as control theory, embedded systems, software modelling, applied software development, Internet of Things, power electronics, mechatronics, and many others. The department's main activities are education, research and development. Training versatile electrical and software engineers with solid practical knowledge is our top priority. Our profile also includes developing high quality software and hardware solutions for industry partners. All of our activities are backed by strong research background.In 2015, the department has organized the 21 st European Wireless (EW) Conference. The EW 2015 conference hosted more than 140 participants from 30 different countries. The 2015 edition of EW was aimed at addressing a key theme on "5G and beyond."The next sections summarize the key research results of the department in year 2015. IoT and Smart CityThe Internet of Things (IoT) is transforming the surrounding physical objects into an ecosystem of information that enriches our everyday life. The IoT represents the convergence of advances in miniaturization, wireless connectivity, and increased data storage, and is driven by various sensors. Application and service development methods and frameworks are required to support the realization of solutions covering data collection, transmission, data processing, analysis, reporting, and advanced querying. Our SensorHUB framework URBMOBI is a mobile environmental sensor that (i) provides temporally and spatially distributed environmental data, (ii) fulfills the need for monitoring at various places without the costs for a large number of fixed measurement stations, (iii) integrates small and precise sensors in a system that can be operated on buses, trams, or other vehicles, (iv) concentrates on urban heat and thermal comfort, and (v) aims at providing climate services and integration with real-time climate models.utilizes the state-of-the-art open source technologies and provides a unified tool chain for IoT related application and ser-URBMOBI project has been worked out between 2013 and 2015 by the following consortium: RWTH Aachen University (Germany), Netherlands Organization for Applied Scientific Research TNO (Netherlands), ARIA Technologies (France), Budapest University of Technology and Economics (Hungary), and Meteorological and Environmental Earth Observation (Italy).The SOLSUN (Sustainable Outdoor Lighting & Sensory Urban Networks) project is about to demonstrate how intelligent city infrastructure can be created in a cost-effective and sustainable way by reusing existing street lighting as the communications backbone. We apply different technologies and methods to reduce energy consumption at the same time as turning streetlights into nodes on a scalable network that is al...

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Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics

Cited by 45 publications

References 35 publications

Electrochemical migration of Sn and Sn solder alloys: a review

Electrochemical migration of Sn and Sn solder alloys: a review

Overview of Selected Issues Related to Soldering

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2015

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