Microstructure and Corrosion Behavior of Sn–Zn Alloys

Abstract

In the present work, the microstructure, phase constitution, and corrosion behavior of binary Sn–xZn alloys (x = 5, 9 and 15 wt.%) were investigated. The alloys were prepared by induction melting of Sn and Zn lumps in argon. After melting, the alloys were solidified to form cast cylinders. The Sn–9Zn alloy had a eutectic microstructure. The Sn–5Zn and Sn–15Zn alloys were composed of dendritic (Sn) or (Zn) and eutectic. The corrosion behavior of the Sn–Zn alloys was studied in aqueous HCl (1 wt.%) and NaCl (3.5 wt.%) solutions at room temperature. Corrosion potentials and corrosion rates in HCl were significantly higher compared to NaCl. The corrosion of the binary Sn–Zn alloys was found to take place by a galvanic mechanism. The chemical composition of the corrosion products formed on the Sn–Zn alloys changed with the Zn weight fraction. Alloys with a higher concentration of Zn (Sn–9Zn, Sn–15Zn) formed corrosion products rich in Zn. The Zn-rich corrosion products were prone to spallation. The corrosion rate in the HCl solution decreased with decreasing weight fraction of Zn. The Sn–5Zn alloy had the lowest corrosion rate. The corrosion resistance in HCl could be considerably improved by reducing the proportion of zinc in Sn–Zn alloys.

Investigation of Microstructure, Mechanics, and Corrosion Properties of Ti6Al4V Alloy in Different Solutions

“…Comparatively, the adhesion is elevated and the oxide layer is diminished in relation to the corrosion samples exposed to 9% NaCl and 25% HCl. Cl − is an anion that can be easily adsorbed [57][58][59]. It can readily infiltrate the metal-oxide interface via the intergranular boundaries of the oxide-hydroxide scale.…”

Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO2 nanoparticles via vacuum melting process

“…Sn-Zn alloys are popular with their magnificent mechanical properties, low melting temperature about 198.5 °C, which makes it closely related to Sn-37Pb (183 °C) solder alloy [9], and low cost, which initiate and encourage them to meet the great challenges of the new lead-free solder development [10,11]. Therefore, Sn-Zn alloys are an advantageous choice due to their economical properties as Zn is an inexpensive metal, which is considered one of the most crucial factors in sorting out the solder materials, besides their high wettability and good ductility this is supposed to have significant influence over the formation of reliable solder connections, especially in lowvolume applications such as robotics, automated processes, and electronic service [12][13][14]. However, because to their low resistance to oxidation and a high corrosion acceptability rate due to the high activity of Zn atoms, Sn-Zn solder alloys has some prohibitions that must be dealt with during its using in the field of microelectronics applications [15].…”

Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

“…Engineers are researching more environmentally friendly process and trying to lower the bonding temperature within a range that does not impair the mechanical reliability of electronic components. The board to package warpage problem that occurs during the reflow process can be significantly reduced by lowering bonding temperature by using low-temperature solders such as Sn-58Bi, Sn-52In, and Sn-9Zn [ 1 , 2 ]. Eutectic Sn-58Bi alloy with a melting point of 139 °C has been widely studied and used for low-temperature soldering [ 3 ].…”