Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy

El-Daly, A.A.; Desoky, W.M.; Elmosalami, T.A.; El-Shaarawy, M.G.; Abdraboh, A. M.

doi:10.1016/j.matdes.2014.08.058

Cited by 81 publications

(29 citation statements)

References 17 publications

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“…As a result, the bonded materials do not separate when used below their melting points. From this viewpoint, nanoparticles of various metal have been examined with the aim of applying them to bonding Daly et al 2015). Silver metal nanoparticles (silver nanoparticles) have been intensively focused on, because silver metal is electrically and thermally conductive as well as being chemically stable.…”

Section: Introductionmentioning

confidence: 99%

Metal–metal bonding using silver/copper nanoparticles

et al. 2015

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A method for producing nanoparticles composed of silver and copper and a metal-metal bonding technique using the silver/copper nanoparticles are proposed. The method consists of three steps. First, copper oxide nanoparticles are produced by mixing Cu(NO 3 ) 2 aqueous solution and NaOH aqueous solution. Second, copper metal nanoparticles are fabricated by reducing the copper oxide nanoparticles with hydrazine in the presence of poly(vinylpyrrolidone) (PVP). Third, silver/copper nanoparticles are synthesized by reducing Ag ? ions with hydrazine in the presence of the copper metal nanoparticles. Initial concentrations in the final silver/copper particle colloid, composed of 0.0075 M Cu 2? , 0.0025 M Ag ? , 1.0 g/L PVP, and 0.6 M hydrazine, produced silver/copper nanoparticles with an average size of 49 nm and a crystal size of 16.8 nm. Discs of copper metal were successfully bonded by the silver/copper nanoparticles under annealing at 400°C and pressurizing at 1.2 MPa for 5 min in not only hydrogen gas but also nitrogen gas. The shear force required to separate the bonded discs was 22.3 MPa for the hydrogen gas annealing and 14.9 MPa for the nitrogen gas annealing (namely, 66.8 % of that for hydrogen gas annealing).

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Section: Introductionmentioning

confidence: 99%

Metal–metal bonding using silver/copper nanoparticles

et al. 2015

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“…Previous studies reported that reinforcement particles may attribute in alter the microstructure become finer and thus improved the properties [8][9][10]. The effect of TiO 2 particles on Sn-0.3Ag-0.5 solder resulting in smaller grain size with an increase in TiO 2 proportion.…”

Section: Eutectic Area Eutectic Areamentioning

confidence: 93%

“…These situations will then result in decreasing the growth velocity of Cu 6 Sn 5 grains. According to heterogeneously nucleation theory, the Cu 6 Sn 5 will nucleate on reinforcement surface in order to reduce the thermodynamic barrier [9]. The increasing amount of reinforcement particles in the solder has caused more reinforcement particles precipitate on …”

Section: Methodsmentioning

confidence: 99%

An Investigation of TiO₂Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite

et al. 2016

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Abstract. In this research, varying fraction of titanium oxide (TiO 2 ) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO 2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO 2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO 2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed further.

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“…Recently, nano-composite solders have been developed due to rapidly changes in technologies and moving towards miniaturized of consumer electronic products including the size of electronic components. The reinforcements of nano-particles to the solder alloys could result in self-organized dispersive systems, which contribute to the heterogeneous nucleation, thus causing the stress in the solder joints to be dispensing uniformly [9][10]. Among all the micrometer and nanometer sized particles as a new reinforcement, graphene has attracted the attention of researchers due to its excellent mechanical, electrical and thermal properties.…”

Section: Introductionmentioning

confidence: 99%

Intermetallic Growth Retardation with the Addition of Graphene in the Sn-3.5Ag Lead-free Solder

Mayappan

Salleh

2017

IOP Conf. Ser.: Mater. Sci. Eng.

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Abstract. In this study, the effect of 0.07 wt.% graphene nanosheets (GNSs) on the thermal, microstructure and intermetallic compounds (IMC) growth kinetics were investigated. Experimental results showed that addition of GNSs to the Sn-3.5Ag solder alloy slightly increased the melting temperature. Scanning electron microscope (SEM) micrograph revealed that with the addition of GNSs has transformed the morphologies of the interfacial IMC from scalloped to more planar-shaped after isothermal aging for 500 hours. Growth kinetics calculations show that the k value was reduced from 9.08 x 10 -14 cm 2 /s to 5.73 x 10 -14 cm 2 /s with the addition of graphene. Thereby, it indicates that the addition of GNSs suppressed the growth of the IMC layers hence retarded the IMC's growth.

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Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy

Cited by 81 publications

References 17 publications

Metal–metal bonding using silver/copper nanoparticles

Metal–metal bonding using silver/copper nanoparticles

An Investigation of TiO₂Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite

Intermetallic Growth Retardation with the Addition of Graphene in the Sn-3.5Ag Lead-free Solder

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Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy

Cited by 81 publications

References 17 publications

Metal–metal bonding using silver/copper nanoparticles

Metal–metal bonding using silver/copper nanoparticles

An Investigation of TiO2Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite

Intermetallic Growth Retardation with the Addition of Graphene in the Sn-3.5Ag Lead-free Solder

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An Investigation of TiO₂Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite