Microstructural evolution and performance of high-tin-content Cu40Sn60 (wt. %) core/shell powder TLPS bonding joints

Fabrication of Cu@Sn TLPS joint for high temperature power electronics application

“…11 , which are superior to that of pure Cu 3 Sn (69.8 W m −1 K −1 and 8.9 μΩ cm) 18 and other Cu@Sn systems in other studies, in the Cu–Sn paste system, TLPS joint had an average thermal conductivity of 140.2 W m −1 K −1 . 26 In the high tin content Cu@Sn core/shell (60 wt% Sn) powder transient liquid phase sintering bonding system, 27 the electrical resistivity was reached its maximum value of 18.3 μΩ cm at 300 °C for 150 min, and the thermal conductivity of the joint was 28.72, 26.83, and 25.99 W m −1 K −1 at 30, 250 and 350 °C, respectively. The uniformly distributed Cu particles play an important role in the thermal conductivity as the thermal conductivity of bulk Cu is 398 W m −1 K −1 , and the IMCs and pores existed in the interface hinder the further improvement of the thermal conductivity and lower electrical resistivity.…”

Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes

“…Ag or Cu) [16,17] and transient liquid phase (TLP) bonding, also known as solid-liquid interdiffusion (SLID) bonding, have proven to be promising bonding methods for high-temperature interconnects. [18][19][20] However, in sintering bonding, due to the evaporation of the organic solvent and protective agent in the particle pastes during the sintering process, void formation in the bonding area may result, potentially compromising the reliability of components for high-temperature applications such as power devices. [21] TLP bonding is a bonding process that involves a reaction between lower melting temperature metals like Sn (in the molten state) and higher melting temperature metals like Cu (in the solid state) to form intermetallic compounds (IMCs) such as Cu 6 Sn 5 or Cu 3 Sn that have a higher melting temperature than the Sn used to form the joint.…”