Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes
N. R. Abdul Razak,
Xin F. Tan,
Stuart D. McDonald
et al.
Abstract:Exploiting the growth rate dependency of intermetallic compounds (IMCs) on the substrate composition, the possibility of controlling porosity during transient liquid phase (TLP) bonding via a composition gradient is investigated. A Cu substrate with a variable Ni concentration was prepared through selective electroplating and subsequent heat treatment.When this substrate reacted with a molten Sn-rich alloy, there was a non-uniform growth of the Cu 6 Sn 5 IMC. It is proposed that by tailoring the direction of t… Show more
Set email alert for when this publication receives citations?
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.