Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling

Li, Qihai; Li, Caifu; Zhang, Wei; Chen, Weiwei; Liu, Zhiquan

doi:10.1016/j.microrel.2019.05.015

Cited by 16 publications

(2 citation statements)

References 24 publications

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“…During the procedure of thermal shock, the solder will creep through atomic diffusion and lattice slippage, which results in defects (such as voids and crack) at the solder [29]. Repeated stresses eventually lead to the formation and growth of interfacial cracks due to the combined damage mechanism of fatigue and creep [30]. Additionally, since the solder joint is affected by both shear stress and temperature, the plastic deformation gradually accumulates inside the solder alloy until the cracks appear [31].…”

Section: Resultsmentioning

confidence: 99%

Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock

et al. 2022

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In 3D packaging memory devices, solder joints are critical links between the chip and the printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to thermal shock. If cracks grow in the solder joint, the chip will be disconnected with the PCB, causing its function failure. In this paper, the reliability of solder joints under thermal shock are evaluated for 3D packaging memory devices by means of the SEM and finite element analysis. As microscopically studied by the SEM, it is found out that the main failure mechanism of solder joints in such test is the thermal fatigue failure of solder joints. Finite element analysis shows that cracks are caused by the accumulation of plastic work and creep strain. The initiation and growth of cracks are mainly influenced by the inelastic strain accumulation. The trends of cracks are influenced by the difference between the coefficient of thermal expansion (CTE) of epoxy resin and that of the chip.

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Section: Resultsmentioning

confidence: 99%

Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock

et al. 2022

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“…An obvious example is in the aviation operating environment. Owing to the obligatory of high reliability of joining beyond extreme condition, Pb-solder still used in aviation even though it is have been banned in consumer products since the year 2006 (Li et al, 2019).…”

Section: Introductionmentioning

confidence: 99%

Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

Ismail

Jalar

Bakar

et al. 2020

SSMT

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Purpose The purpose of this paper is to investigate the effect of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and micromechanical properties of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint under blast wave condition. This work is an extension from the previous study of microstructural evolution and hardness properties of Sn-Ag-Cu (SAC) solder under blast wave condition. Design/methodology/approach SAC/CNT solder pastes were manufactured by mixing of SAC solder powder, fluxes and CNT with 0.02 and 0.04 by weight percentage (Wt.%) separately. This solder paste then printed on the printed circuit board (PCB) with the copper surface finish. Printed samples underwent reflow soldering to form the solder joint. Soldered samples then exposed to the open field air blast test with different weight charges of explosives. Microstructure, interfacial IMC layer and micromechanical behavior of SAC/CNT solder joints after blast test were observed and analyzed via optical microscope, field emission scanning microscope and nanoindentation. Findings Exposure to the blast wave induced the microstructure instability of SAC305/Cu and SAC/CNT/Cu solder joint. Interfacial IMC layer thickness and hardness properties increases with increase in explosive weight. The existence of CNT in the SAC305 solder system is increasing the resistance of solder joint to the blast wave. Originality/value Response of micromechanical properties of SAC305/CNT/Cu solder joint has been identified and provided a fundamental understanding of reliability solder joint, especially in extreme conditions such as for military applications.

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Residual Stress Characterization in Microelectronic Manufacturing: An Analysis Based on Raman Spectroscopy

Yang,

Wang,

Chen

et al. 2024

Laser & Photonics Reviews

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In the rapidly evolving era of information and intelligence,microelectronic devices are pivotal across various fields, such as mobile devices, big data computing, electric vehicles, and aerospace. However, the electrical performance of these devices often suffers due to residual stress from microelectronic manufacturing. This issue is compounded by the additional thermal stress that accumulates during device operation. Therefore, it is essential to understand, characterize, and control this residual stress to ensure the reliability and efficiency of microelectronic devices. Raman spectroscopy emerges as an invaluable tool for nondestructive, fast, noncontact, and precise testing of micro‐scale mechanics, significantly aiding in stress and strain analysis within microelectronic manufacturing. This article aims to provide a thorough overview of the theory and application beyond a mere compilation of recent advances. Theoretically, it critically evaluates existing models that describe the Raman‐stress relation. Practically, it explores the application of Raman spectroscopy in researching residual stress in various components, including substrate materials, epitaxial films, and packaging. Through a detailed examination of current applications, it highlights the significance of Raman spectroscopy in understanding micro‐scale mechanics. Finally, it offers both theoretical and practical insights into the future developments of Raman‐stress detection technology.

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Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling

Cited by 16 publications

References 24 publications

Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock

Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock

Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

Residual Stress Characterization in Microelectronic Manufacturing: An Analysis Based on Raman Spectroscopy

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