Special Issue PaperKey words: Diffusion path, interfacial reaction, metallization, nickel-palladium, Ni 3 Sn 4 , PdSn 4 , solder related to materials, processing, and operation of electronic devices it has been realized that the soldering technology plays an important role in the reliability of the electronic packages. These factors include the use of increasingly dense arrays of interconnects, the miniaturization of electronic packages and the associated miniaturization of solder joints, the use of lead-free solders, the higher operating temperature 1183 A Comparative Study of the Kinetics of Interfacial Reaction Between Eutectic Solders and Cu/Ni/Pd Metallization