Microstructural defect characterisation of a-Si:H deposited by low temperature HW-CVD on paper substrates

Britton, D.T.; Härting, M.; Knoesen, D.; Sigcau, Z.; Nemalili, F.P.; Ntsoane, T.P.; Sperr, P.; Egger, Werner; Nippus, M.

doi:10.1016/j.tsf.2005.07.111

Cited by 3 publications

(2 citation statements)

References 14 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[ 4 , 95 ] a-Si:H fi lms have, however, been applied by CVD directly onto paper with an electron mobility of 0.2 cm 2 V − 1 s − 1 (at 150-220 ° C). [ 96 ] Si can be solution processed by using precursors or NPs, but a very high annealing temperature (550-750 ° C) in inert atmosphere is typically required. [ 97 , 98 ] A possible solution to this problem is to use a hybrid system, such as Si NPs mixed with a polymer.…”

Section: Inorganic Semiconductorsmentioning

confidence: 99%

Paper Electronics

Tobjörk¹,

Österbacka²

2011

Advanced Materials

1,189

1,040

View full text Add to dashboard Cite

Paper is ubiquitous in everyday life and a truly low-cost substrate. The use of paper substrates could be extended even further, if electronic applications would be applied next to or below the printed graphics. However, applying electronics on paper is challenging. The paper surface is not only very rough compared to plastics, but is also porous. While this is detrimental for most electronic devices manufactured directly onto paper substrates, there are also approaches that are compatible with the rough and absorptive paper surface. In this review, recent advances and possibilities of these approaches are evaluated and the limitations of paper electronics are discussed.

show abstract

Section: Inorganic Semiconductorsmentioning

confidence: 99%

Paper Electronics

Tobjörk¹,

Österbacka²

2011

Advanced Materials

1,189

1,040

View full text Add to dashboard Cite

show abstract

“…4B). This approach to electronics on paper provides an alternative to those that rely on direct thin film deposition of organic [29][30][31][32] or inorganic [33][34][35] electronic materials.…”

mentioning

confidence: 99%

Ultrathin Silicon Circuits With Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper

et al. 2009

View full text Add to dashboard Cite

We present various stretchable high‐performance CMOS circuit demonstrations on unconventional substrates, such as fabric, vinyl, leather, and paper. Electronics on such substrates, especially paper, open up new and important application possibilities for electronics. Theoretical analysis reveals the underlying mechanics of these systems; electrical tests under mechanical cycling demonstrate the robustness of the designs.

show abstract