1998
DOI: 10.1088/0953-2048/11/1/015
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Microstructural aspects of joining superconductive components using solder

Abstract: Investigations of superconductive joints were performed using an infiltration technique. Gaps between two domains of were prepared mechanically and subsequently filled with powder. Barium cuprate liquid prepared by the peritectic decomposition of was infiltrated into the gap between the two domains. Microstructural analysis indicates a local epitaxy of the solder.

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Cited by 17 publications
(12 citation statements)
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“…Mechanically robust joints with a highly aligned structure and low residual porosity have been produced using this technique. However to-date no superconducting properties have been reported for this type of joint [19,20].…”
Section: Introductionmentioning
confidence: 96%
See 1 more Smart Citation
“…Mechanically robust joints with a highly aligned structure and low residual porosity have been produced using this technique. However to-date no superconducting properties have been reported for this type of joint [19,20].…”
Section: Introductionmentioning
confidence: 96%
“…This uses the same principle as the IG technique for growing large single grains. A variety of ytterbium, yttrium and erbium-based powder compositions have been trialled for this purpose [19]. The RE-211 powder has a lower decomposition temperature than YBCO, so the bulk superconductor sections both remain solid throughout the joining process and facilitate epitaxial nucleation.…”
Section: Introductionmentioning
confidence: 99%
“…Techniques used to form joints between bulk superconductors can be grouped into four categories. These are solid-state diffusion, infiltration joining, welding using an intermediate material with a lower peritectic temperature and joining using a non-superconducting intermediary to locally lower the peritectic temperature of the interface between the (RE)BCO bulks [11][12][13][14][15][16][17][18][19][20][21].…”
Section: Introductionmentioning
confidence: 99%
“…Using low melt temperature REBCO as a superconducting solder has also been used in joining Y123 single domain bulks [14][15][16][17][18]. In all these researches, appropriate oxygen annealing is essential to achieve high supercurrent capability [19].…”
Section: Introductionmentioning
confidence: 99%