Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co

Cheng, Fangjie; Nishikawa, Hiroshi; Takemoto, Tadashi

doi:10.1007/s10853-008-2580-7

Cited by 62 publications

(19 citation statements)

References 18 publications

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“…In general, various properties of metals and multi-phase alloys are known to be closely related to their microstructures, existent phases and chemical compositions of each component phase [18,19]. The present…”

Section: Discussionmentioning

confidence: 87%

Optical properties and microstructures of Pd-free Ag–Au–Pt–Cu dental alloys

et al. 2009

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Nine experimental Pd-free Ag-Au-Pt-Cu dental alloys containing 10 at.% Pt and 10 to 35 at.% Au were prepared and their optical properties and microstructures were investigated by means of spectrophotometric colorimetry, optical microscopy, and electron probe microanalysis. All the alloys were annealed at 850°C and mirror-polished to observe their reflectance curves in the visible spectrum and three-dimensional color coordinates. All the alloys were composed of a major phase of Ag-Au-rich matrix and a minor and almost colorless Pt-Cu-rich phase. It was found that the color of the alloys was substantially controlled by the Ag-Au-rich matrix and that with increasing Au/Ag atomic ratio from 0.130 to 0.996, the yellow-blue chromaticity index b* increased from 8.0 to 14.4, giving a pale yellow color. This systematic increase in yellowness was caused by a continuous shift of the absorption edge of reflectance curve towards longer wavelengths with increasing Au/Ag atomic ratio.

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Section: Discussionmentioning

confidence: 87%

Optical properties and microstructures of Pd-free Ag–Au–Pt–Cu dental alloys

et al. 2009

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“…It has been found that Co additions are particularly effective at suppressing the nucleation undercooling of βSn [20][21][22][23][24][25][26][27][28][29]. Table 1 summarises 10 past studies on Co-microalloyed solders.…”

Section: The Paper Published In Journal Of Alloys and Compounds In 2016mentioning

confidence: 99%

Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

Belyakov

Gourlay

2016

Journal of Alloys and Compounds

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We show that cobalt-microalloying causes significant grain refinement in large samples (60g) of Sn-3Ag-0.5Cu solder. Nucleation occurs on the (100) facet of CoSn 3 crystals with a reproducible orientation relationship of (100) ∥ (100) withwhich has a planar lattice mismatch of ~4%. In 550m solder joints on Cu substrates, Co microalloying alters the Sn nucleation location to an CoSn 3 particle in the bulk liquid and increases the number of Sn nucleation events when the cooling rate is higher than ~5 K/s.However, Co-microalloying caused only weak grain refinement in sample volumes relevant to solder joints which is explained using nucleation and grain refinement theories.

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“…In addition, the solubility of Ni could significantly stabilize (Cu,Ni) 6 Sn 5 . 16 Because the solubility of Ni is zero in the b-Sn phase and very high in the Cu 6 Sn 5 phase, 20 Ni, like Cu, is transferred from b-Sn to the IMC phase during coupled growth. This suggests that Ni addition may significantly decline Ni 3 Sn 4 formation in Sn-rich SAC alloys.…”

Section: Microstructural Investigationmentioning

confidence: 99%

“…15 In previous studies, Ni additives had little effect on the tensile strength of SAC (305) solder, but obviously suppressed the elongation ratio and reduction of area. 16 In light of the above, the aim of this study is to develop a comparative evaluation of the microstructural and mechanical properties of as-cast SAC (205) and SAC (0505) solders containing 0.05Ni.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Hammad

El-Taher

2014

Journal of Elec Materi

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The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni) 6 Sn 5 intermetallic compounds (IMCs) inside the b-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni) 6 Sn 5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)-and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

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Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co

Cited by 62 publications

References 18 publications

Optical properties and microstructures of Pd-free Ag–Au–Pt–Cu dental alloys

Optical properties and microstructures of Pd-free Ag–Au–Pt–Cu dental alloys

Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

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