Microsensor packaging

Abstract

Packaging is crucial for the success of microsensors and microsystems, and typically a major, if not dominating cost component. Bene®ting from packaging methods for integrated circuits (IC), microsystem packaging currently strongly relies on customized solutions. The paper summarizes challenges in microsensor and microsystem packaging and brie¯y discusses current packaging trends. In the second part of the paper, a packaged low-cost CMOS thermal imager is presented. Its packaging is based on the direct attachment of a silicon infrared ®lter onto the CMOS sensor die. The ®nal microsystem is further packaged in a plastic ball grid array (BGA) enabling subsequent assembly by standard surface mount technology.

Reliability of MEMS packaging: vacuum maintenance and packaging induced stress

“…Therefore, packaging technology becomes a key issue for successful commercialization of MEMS devices (Kelly et al 1997;Brand and Baltes 2002). However, there is little published work on the long-term reliability of the MEMS packaging as most of this work remains proprietary.…”

Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

“…For example, image sensor module requires a relative low process temperature (below 200 • C) because it contains polymer structures like micro-lens which is sensitive to the temperature [8]. Various low temperature wafer bonding technologies have been investigated and they are categorized as two main approaches, i.e., direct bonding using special surface treatment techniques (such as plasma surface activated bonding [9], atom beam irradiation [10]) and intermediate layer bonding using polymers [11] and low temperature solders based on diffusion soldering method [12][13][14][15][16][17][18][19][20][21][22][23].…”

“…The principle of diffusion soldering is the formation of homogeneous intermetallic compounds (IMCs) in the bonding process [24]. The applications of diffusion soldering technique in electronics packaging are like wafer level hermetic sealing [1,2,8,[12][13][14][15][16][17][18][19][20][21][22][23] and three-dimensional (3-D) interconnects for 3-D stacked ICs (integrated circuits) or MEMS [24].…”

A Survey of Modeling and Control Techniques for Micro- and Nanoelectromechanical Systems

“…With improved fabrication methods, component densities on a chip have increased drastically and on-board sensors and power sources have become the norm, [147], [148], [149], [150]. Thus, the system-on-chip concept with on-chip control is now gaining popularity, [151], [152], [153].…”