Microscopic properties of a nanocrystal aluminum thin film during nanoimprint using quasi-continuous method

Fang, Te‐Hua; Chang, Win−Jin; Yu, Dong-Jie; Huang, Chao-Chun

doi:10.1016/j.tsf.2016.06.023

Cited by 7 publications

(2 citation statements)

References 27 publications

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“…With commercially accessible bonding equipment, Cu-Cu bonding with a temperature gradient in ambient settings can meet the industry requirement for heterogeneous chip integration [4,16]. The quasi-continuous method has diverse applications, including nanoimprinting [17][18][19][20][21][22], nanocutting [23,24], nanomilling [25], grinding [26], nanowelding [27][28][29], bending and punching [30], cyclic loading [31,32], nanoindentation [33][34][35][36][37][38], rough surfaces [39], interface fracture [40], crack growth characteristics [41], and plastic deformation [42,43] processes, enabling the analysis of plastic deformation and internal mechanical responses occurring within a material subjected to the influence of an indenter involves a comprehensive analysis. This analysis delves into the intricate processes occurring within the material as it undergoes deformation, elucidating the internal mechanisms at play.…”

Section: Introductionmentioning

confidence: 99%

Study on copper-to-copper bonding of three-dimensional integrated circuits using the quasicontinuum method

Nguyen,

Wu,

Fang

2024

Phys. Scr.

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Cu-Cu bonding presents an attractive approach to bottom-up manufacturing, facilitating nanoparticle production, linking, and restoration. The ramifications of varying bonding depths and orientations exhibit distinct characteristics. At the same time, investigations into the material composition of nanoscale bonded pairs involve scrutiny of atomic slippage, strain distribution, and the force-displacement profile. The methodology simulates the Cu-Cu bonding process by implementing the quasi-continuum (QC) approach, constituting a multifaceted mixed molecular dynamics technique integrating atomistic and continuum methods. The analysis of results reveals variations in the Contact effect induced by the four orientations, along with discrepancies in the atomic slippage observed in distinct directions. Notably, a pronounced distinction is discernible in the directional movement. Specifically, the strained regions on the flat surface of the lower substrate, characterized by the directionality of X[001]-Y[110], exhibit a notably broader range of atomic slip compared to regions strained by alternative orientations. Furthermore, the directional alignment of X[110]-Y[111] illustrates that irrespective of whether the lower substrate’s surface is flat or rough, the orientation of atomic slip diverges. In conclusion, our study employed a quasi-continuous method to explore the bonding efficacy of copper-to-copper interfaces on flat and irregular substrate surfaces. Through this approach, we scrutinized the distributions of strain, stress, average Newtonian force, and atom differential arrangement direction across different orientations.

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Section: Introductionmentioning

confidence: 99%

Study on copper-to-copper bonding of three-dimensional integrated circuits using the quasicontinuum method

Nguyen,

Wu,

Fang

2024

Phys. Scr.

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“…However, the simulation of localized deformation and fracture in heterogeneous systems requires the use of relatively large systems and appropriate boundary conditions, which may result in system sizes difficult to access using direct MD due to the very time-consuming. The quasicontinuum (QC) method is a multi-scale combined MD approach (Tadmor et al 1996a, b;Qiu et al 2017;Fang et al 2016) that mixed continuum and atomistic approach for simulating the mechanical response of the crystal materials. The previous QC simulation of the cold welding into T junctions (Wu et al 2018) found that, at a small contact interference of 0-1 nm, the ultimate stress of welded pairs is independent of the magnitude of contact interference.…”

Section: Introductionmentioning

confidence: 99%

Nanowelding of nickel and copper investigated using quasi-continuum simulations

Fang

Lin

et al. 2018

Multiscale and Multidiscip. Model. Exp. and Des.

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The effects of contact interference, crystal orientation, and material type on the cold nanowelding mechanism and mechanics are studied using quasi-continuum simulations. These effects are investigated in terms of atomic trajectories, strain distribution, and the stress-strain curve. The simulation results show that welding using a contact interference of 0 nm leads to the formation of the fewest defects inside the material during cold welding, and that the number of defects increases with increasing contact interference. For the Ni-Ni welding pair, welding using a contact interference of 0 nm with the structural orientation [110] versus [001] has the largest ultimate strength and longest elongation during tensile testing due to the formation of fewer defects during welding. The welding quality obtained with the Ni-Ni welding pair is higher than that obtained with Ni-Cu and Cu-Cu welding pairs. During the tensile deformation process, dislocations nucleate from the free surface, propagate along the close-packed plane, and then terminate at the other free surface.

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Effects of alloy composition, cavity aspect ratio, and temperature of imprinted ZrCu metallic glass films: a molecular dynamics study

2020

Appl. Phys. A

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Microscopic properties of a nanocrystal aluminum thin film during nanoimprint using quasi-continuous method

Cited by 7 publications

References 27 publications

Study on copper-to-copper bonding of three-dimensional integrated circuits using the quasicontinuum method

Study on copper-to-copper bonding of three-dimensional integrated circuits using the quasicontinuum method

Nanowelding of nickel and copper investigated using quasi-continuum simulations

Effects of alloy composition, cavity aspect ratio, and temperature of imprinted ZrCu metallic glass films: a molecular dynamics study

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