Microscale Silicon Origami

Song, Ziqi; Lv, Cheng; Liang, Mengbing; Sanphuang, Varittha; Wu, Kedi; Chen, Bin; Zhao, Zhi; Bai, Jing; Wang, Xu; Volakis, John L.; Wang, Liping; He, Ximin; Yao, Yu; Tongay, Sefaattin; Jiang, Hanqing

doi:10.1002/smll.201601947

Cited by 34 publications

(26 citation statements)

References 29 publications

(32 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Traditional manufacturing methods for assembling origami structures mainly rely on manual or machine‐assisted folding, which is challenging to implement on small scales and advanced materials . Self‐folding ranging from nanoscale to microscale and macroscale of various materials including metals, semiconductors, and polymers have been achieved by self‐actuating materials (e.g., shape memory materials), or using stimuli‐active hinges (e.g., by heat, light, or electricity), capillary forces, or residual stresses in the thin film. Figure c illustrates the process of self‐folding Al 2 O 3 facets with Au patterns.…”

Section: Structural Designs For Soft Electronicsmentioning

confidence: 99%

Materials and Structures toward Soft Electronics

et al. 2018

View full text Add to dashboard Cite

Soft electronics are intensively studied as the integration of electronics with dynamic nonplanar surfaces has become necessary. Here, a discussion of the strategies in materials innovation and structural design to build soft electronic devices and systems is provided. For each strategy, the presentation focuses on the fundamental materials science and mechanics, and example device applications are highlighted where possible. Finally, perspectives on the key challenges and future directions of this field are presented.

show abstract

Section: Structural Designs For Soft Electronicsmentioning

confidence: 99%

Materials and Structures toward Soft Electronics

et al. 2018

View full text Add to dashboard Cite

show abstract

“…The patterned structure was transferred to a water soluble tape to expose the backside surface. The surface chemical treatments (e.g., ultraviolet/ozone treatments) were used to introduce hydroxy group to the certain bonding sites (i.e., anchors) of backside surface with the help of lithography. Then, the patterned nanomembrane was finally transferred to a tensilely prestrained silicone elastomer, whose surface was also chemically functionalized with hydroxy group.…”

Section: Nanomembrane Origamimentioning

confidence: 99%

Assembly and Self‐Assembly of Nanomembrane Materials—From 2D to 3D

Huang

Mei

2018

Small

View full text Add to dashboard Cite

Nanoscience and nanotechnology offer great opportunities and challenges in both fundamental research and practical applications, which require precise control of building blocks with micro/nanoscale resolution in both individual and mass-production ways. The recent and intensive nanotechnology development gives birth to a new focus on nanomembrane materials, which are defined as structures with thickness limited to about one to several hundred nanometers and with much larger (typically at least two orders of magnitude larger, or even macroscopic scale) lateral dimensions. Nanomembranes can be readily processed in an accurate manner and integrated into functional devices and systems. In this Review, a nanotechnology perspective of nanomembranes is provided, with examples of science and applications in semiconductor, metal, insulator, polymer, and composite materials. Assisted assembly of nanomembranes leads to wrinkled/buckled geometries for flexible electronics and stacked structures for applications in photonics and thermoelectrics. Inspired by kirigami/origami, self-assembled 3D structures are constructed via strain engineering. Many advanced materials have begun to be explored in the format of nanomembranes and extend to biomimetic and 2D materials for various applications. Nanomembranes, as a new type of nanomaterials, allow nanotechnology in a controllable and precise way for practical applications and promise great potential for future nanorelated products.

show abstract

“…While traditional origami is made from paper, engineering applications of origami generally use a wide range of materials, including polymers [63][64][65], metals [38,66], composites [33,34], silicon [67], wood, etc. The size range of origami-inspired engineering forms can run from microscopic [43,68,69] to building size [18,70].…”

Section: Introductionmentioning

confidence: 99%

A Review of Thickness-Accommodation Techniques in Origami-Inspired Engineering

Lang¹,

Tolman

Crampton

et al. 2018

Applied Mechanics Reviews

153

View full text Add to dashboard Cite

Origami has served as the inspiration for a number of engineered systems. In most cases, they require nonpaper materials where material thickness is non-negligible. Foldable mechanisms based on origami-like forms present special challenges for preserving kinematics and assuring non-self-intersection when the thickness of the panels must be accommodated. Several design approaches for constructing thick origami mechanisms by beginning with a zero-thickness origami pattern and transforming it into a rigidly foldable mechanism with thick panels are reviewed. The review includes existing approaches and introduces new hybrid approaches. The approaches are compared and contrasted and their manufacturability analyzed.

show abstract

Microscale Silicon Origami

Cited by 34 publications

References 29 publications

Materials and Structures toward Soft Electronics

Materials and Structures toward Soft Electronics

Assembly and Self‐Assembly of Nanomembrane Materials—From 2D to 3D

A Review of Thickness-Accommodation Techniques in Origami-Inspired Engineering

Contact Info

Product

Resources

About