2020
DOI: 10.3390/ma13132962
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Micromachining of Invar with 784 Beams Using 1.3 ps Laser Source at 515 nm

Abstract: To fulfil the requirements for high-resolution organic light-emitting diode (OLED) displays, precise and high-quality micrometer-scale patterns have to be fabricated inside metal shadow masks. Invar has been selected for this application due to its unique properties, especially a low coefficient of thermal expansion. In this study, a novel cost-efficient method of multi-beam micromachining of invar will be introduced. The combination of a Meopta beam splitting, focusing and monitoring module with a gal… Show more

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Cited by 16 publications
(14 citation statements)
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“…An alternative to polygon scanning systems can be beamsplitting by diffractive optical element (DOE) coupled with standard galvo scanning systems 28 31 . However, a large number of beams in order of thousands can be problematic due to the large separation distance of standard DOEs (typically > 10 times diffraction limited spot diameter) which results in a large irradiated area thus limiting scanning options due to scan-angle dependent distortions and limited scan area.…”
Section: Introductionmentioning
confidence: 99%
“…An alternative to polygon scanning systems can be beamsplitting by diffractive optical element (DOE) coupled with standard galvo scanning systems 28 31 . However, a large number of beams in order of thousands can be problematic due to the large separation distance of standard DOEs (typically > 10 times diffraction limited spot diameter) which results in a large irradiated area thus limiting scanning options due to scan-angle dependent distortions and limited scan area.…”
Section: Introductionmentioning
confidence: 99%
“…High-resolution of required structures results in longer fabrication times, as well as delicate power-handling close to damage threshold to ensure high-quality processing without thermal damage to the surroundings. To improve the fabrication time and use the laser source more efficiently, multi-beam processing can be applied [ 9 ]. However, commonly used diffractive beamsplitters may not provide sufficient freedom in adjusting the spacing between beamlets during process optimization.…”
Section: Introductionmentioning
confidence: 99%
“…One of the most promising solutions for industrial utilization of lasers for micromachining is multi-beam processing. In this solution, the incident beam is split into a matrix of sub-beams for simultaneous fabrication inside the optimal processing window [19]. This can be achieved by several techniques including Direct Laser Interference Patterning (DLIP) [20,21] and beam splitting by Diffractive Optical Element (DOE) [22] or Spatial Light Modulator (SLM) [23].…”
Section: Introductionmentioning
confidence: 99%
“…Efficient micromachining with high power-ultrashort laser pulses and 144 sub-beams was also reported by Gillner et al [ 28 ]. More than 784 sub-beams were applied for micromachining of invar in the previous work of authors [ 19 ]. However, to efficiently utilize the new generation of ultrashort laser systems with power above 0.5 kW and millijoule pulse energy [ 29 ] significantly higher number of sub-beams would be required for high-quality micro and nanostructuring together with a new type of DOEs.…”
Section: Introductionmentioning
confidence: 99%