Micromachining of 4H-SiC using femtosecond laser

Zhang, Ru; Huang, Chuanzhen; Wang, Jun; Zhu, Hongtao; Yao, Peng; Feng, Shaochuan

doi:10.1016/j.ceramint.2018.06.245

Cited by 40 publications

(12 citation statements)

References 16 publications

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“…predicted the influence of these variables by establishing a mathematical model of the depth and width dimensions of microgrooves, which was experimentally verified to have an average error of only about 1.3%, so the correctness of the model can be guaranteed. [ 49 ] The results show that the microgroove depth and surface roughness are positively correlated with the laser power, pulse repetition rate, and scanning speed. The group also studied the evolution of femtosecond laser‐irradiated SiC from micro nanostructures to V‐grooves and analyzed the material removal mechanism and morphology control methods.…”

Section: Microchannel Structuresmentioning

confidence: 99%

Femtosecond Laser Fabrication of Microchannels in Transparent Hard Materials

Wang

et al. 2023

Adv Materials Technologies

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The excellent characteristics of transparent hard materials such as high hardness, high transparency, corrosion resistance, and high temperature resistance enable their applications in microfluidic substrates even in harsh environments. Microchannels are important parts in microfluidic systems, and the preparation of microchannel structures in transparent hard materials deserves further in‐depth study. The traditional processing method is contact processing with large thermal influence and low processing efficiency, so it is impossible to obtain complex microchannels with high quality and high aspect ratio. The femtosecond laser processing is a non‐contact processing approach with no thermal damage, high processing accuracy, and easy to form complex microchannels, making it the best choice for processing microchannels in transparent hard materials. This work reviews the recent advances in femtosecond laser processing of transparent hard materials to form microchannel structures, focusing on the reaction mechanism, processing methods, and the obtained microchannel structures, including surface microchannels, 2D microchannels, and 3D microchannels. Furthermore, the application of microchannel structure in microfluidic field, including optical inspection and biochemical reaction, is also described.

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Section: Microchannel Structuresmentioning

confidence: 99%

Femtosecond Laser Fabrication of Microchannels in Transparent Hard Materials

Wang

et al. 2023

Adv Materials Technologies

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“…In past decades, femtosecond laser micromachining has been considered a superior material processing tool, capable of generating complex geometries without photomasks and cleanroom facilities, enabling the processing of materials in different atmospheres, as well as in a vacuum. Various targets are feasible to be ablated by the femtosecond laser irradiation [70][71][72]. Even diamond, with Mons' hardness scale of 10, can be processed [73].…”

Section: Femtosecond Laser Fabrication In Microscale (1 ~100 μM)mentioning

confidence: 99%

Femtosecond Laser Precision Engineering: From Micron, Submicron, to Nanoscale

2021

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As a noncontact strategy with flexible tools and high efficiency, laser precision engineering is a significant advanced processing way for high-quality micro-/nanostructure fabrication, especially to achieve novel functional photoelectric structures and devices. For the microscale creation, several femtosecond laser fabrication methods, including multiphoton absorption, laser-induced plasma-assisted ablation, and incubation effect have been developed. Meanwhile, the femtosecond laser can be combined with microlens arrays and interference lithography techniques to achieve the structures in submicron scales. Down to nanoscale feature sizes, advanced processing strategies, such as near-field scanning optical microscope, atomic force microscope, and microsphere, are applied in femtosecond laser processing and the minimum nanostructure creation has been pushed down to ~25 nm due to near-field effect. The most fascinating femtosecond laser precision engineering is the possibility of large-area, high-throughput, and far-field nanofabrication. In combination with special strategies, including dual femtosecond laser beam irradiation, ~15 nm nanostructuring can be achieved directly on silicon surfaces in far field and in ambient air. The challenges and perspectives in the femtosecond laser precision engineering are also discussed.

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“…Tsibidis et al used an optimized two-temperature model to study the dynamics of excited carriers during femtosecond laser ablation of silicon carbide and theoretically calculated the surface damage threshold of silicon carbide materials [11]. Zhang et al used a femtosecond laser to etch the surface of a 4H-SiC wafer, obtained smooth micro-groove sidewalls, and analyzed the heat-affected zone and material oxidation effect [20]. Rehman et al found that amorphous silicon (a-Si) and amorphous carbon (a-C) appeared in the area after femtosecond laser ablation of 4H-SiC, and dislocations and deformations appeared in the crystal structure, indicating that the silicon carbide single-crystal material under laser ablation is subject to a certain degree of thermal stress [21].…”

Section: Introductionmentioning

confidence: 99%

Experimental study on femtosecond laser ablation of 4H–SiC substrate

Zhao,

Peng

2024

J. Micromech. Microeng.

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Data AccessStatement: Research data supporting this publication are available from the NN repository at located at www.NNN.org/download/.Silicon carbide (SiC) is an ideal substrate for manufacturing high-power electronic devices and microwave devices, and has broad application prospects. The surface treatment of SiC wafers plays a critical role and faces challenges in the semiconductor industry. Among the multiple treatment methods, the laser-based method has gradually attracted the attention of scholars. Therefore, this research uses a femtosecond laser to ablate 4H-SiC sliced wafers and analyzes the influence of key parameters, such as laser pulse energy, defocus amount, repetition frequency, and scanning intervals, on the laser ablation depth, width, and surface morphology. Scanning electron microscopy (SEM) and laser coherence-focused microscopy were used to characterize the laser ablation surface. The results show that under a defocus amount of +6 mm, a laser pulse energy of 87.5 μJ, scanning speed of 500 mm/s, and pulse frequency of 300 kHz. The results show that the optimized surface roughness (Sa) was 0.267μm, and brittle fracture areas such as microcracks and pits on the original surface were removed. Effective removal facilitates further material surface processing, which provides valuable insights for similar researchers and benefits for the semiconductor industry.Ethical Compliance: All procedures performed in studies involving human participants were in accordance with the ethical standards of the institutional and/or national research committee and with the 1964 Helsinki Declaration and its later amendments or comparable ethical standards.

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Micromachining of 4H-SiC using femtosecond laser

Cited by 40 publications

References 16 publications

Femtosecond Laser Fabrication of Microchannels in Transparent Hard Materials

Femtosecond Laser Fabrication of Microchannels in Transparent Hard Materials

Femtosecond Laser Precision Engineering: From Micron, Submicron, to Nanoscale

Experimental study on femtosecond laser ablation of 4H–SiC substrate

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