2021
DOI: 10.34133/2021/9783514
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Femtosecond Laser Precision Engineering: From Micron, Submicron, to Nanoscale

Abstract: As a noncontact strategy with flexible tools and high efficiency, laser precision engineering is a significant advanced processing way for high-quality micro-/nanostructure fabrication, especially to achieve novel functional photoelectric structures and devices. For the microscale creation, several femtosecond laser fabrication methods, including multiphoton absorption, laser-induced plasma-assisted ablation, and incubation effect have been developed. Meanwhile, the femtosecond laser can be combined with micro… Show more

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Cited by 109 publications
(59 citation statements)
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References 153 publications
(147 reference statements)
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“…First, undoped silicon wafers were cleaned with acetone, ethanol, and deionized water for 30 min to obtain a clean surface. The femtosecond laser (343 nm, 200 kHz, 280 fs (Light Conversion Pharos, Vilnius, Lithuania)) is tightly focused through a high numerical aperture objective lens (NA = 0.95, 40×) and matched with a three-dimensional piezoelectric platform (the strokes of the xand y-axes are 1.5 mm, that of the z-axis is 100 µm, and accuracy is 1 nm) to realize the preparation of micro/nanostructures on the silicon surface [24][25][26][27][28][29]. In addition, the femtosecond laser can also be used to process other materials via multi-photon absorption, for example, lift off GaN [30,31].…”
Section: Methodsmentioning
confidence: 99%
“…First, undoped silicon wafers were cleaned with acetone, ethanol, and deionized water for 30 min to obtain a clean surface. The femtosecond laser (343 nm, 200 kHz, 280 fs (Light Conversion Pharos, Vilnius, Lithuania)) is tightly focused through a high numerical aperture objective lens (NA = 0.95, 40×) and matched with a three-dimensional piezoelectric platform (the strokes of the xand y-axes are 1.5 mm, that of the z-axis is 100 µm, and accuracy is 1 nm) to realize the preparation of micro/nanostructures on the silicon surface [24][25][26][27][28][29]. In addition, the femtosecond laser can also be used to process other materials via multi-photon absorption, for example, lift off GaN [30,31].…”
Section: Methodsmentioning
confidence: 99%
“…Ultrafast laser direct writing techniques exhibit the ability to achieve precision and repeatable micro-/nanostructures on a large variety of materials with little sensitivity to processing conditions. [14][15][16][17] Highnumerical aperture (NA) objective lens is commonly used for increasing resolution in nanostructure fabrication, but how to surpass the diffraction limit remains a critical issue. [18] To overcome this limitation, manufacturing methods based on some unique optical effects which support effective fabrication of high-resolution nanowires are exploited, including photopolymerization from nonlinear absorption, [19][20][21][22] laser-excited plasmonic lithography, [23][24][25][26][27] and locally near-field ablation.…”
Section: Far-field Parallel Direct Writing Of Sub-diffraction-limit M...mentioning
confidence: 99%
“…Across the scientific community, numerous innovative approaches have been pursued in order to reach a high-flourishing upswing in optical responses of the nano-photonic systems in diverse terms. Aiming for such advancements in miscellaneous nano-scale optical features, such as fabrication of diverse nanoparticles (NPs) in liquids [1][2][3][4][5], exotic nanostructures (NSs) (in air/liquid) with desired plasmonic response, and attaining enhanced optical features, such as surface-enhanced Raman spectroscopy (SERS), significant improvisations have been undertaken in laser-matter interaction research. Implementation of non-Gaussian beam profile in laser ablation, and engagement of different off-axis geometrical optics has been quite significant.…”
Section: Introductionmentioning
confidence: 99%