2012
DOI: 10.1016/j.mee.2012.06.014
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Micromachined membrane structures for pressure sensors based on AlGaN/GaN circular HEMT sensing device

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Cited by 30 publications
(16 citation statements)
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“…The AlN interfacial layer served as the etch‐stop layer of the trench‐free silicon etching . Low‐frequency pulsing bias power was used to minimize destructive etching effects at the membrane base .…”
Section: Methodsmentioning
confidence: 99%
“…The AlN interfacial layer served as the etch‐stop layer of the trench‐free silicon etching . Low‐frequency pulsing bias power was used to minimize destructive etching effects at the membrane base .…”
Section: Methodsmentioning
confidence: 99%
“…The III-V nitrides is also having a high potential for monolithic integration [ 21 ]. There have been various studies on the AlGaN/GaN based pressure sensors for room temperature sensing applications [ 22 , 23 ]. In this article, we have investigated high temperature pressure sensing behavior of AlGaN/GaN based devices and its electrical properties with the applied pressure have been studied with the temperature.…”
Section: Introductionmentioning
confidence: 99%
“…A double side micromachining technique was shown to be suitable for the preparation of FBAR [27] and metal-semiconductor-metal ultraviolet photodetectors [66][67][68] The micromachining technique was also applied for the preparation of 1.9-µ m-thick AlGaN/GaN membrane structures patterned on silicon substrate as sensing element of pressure sensors based on a circular high electron mobility transistor (C-HEMT) (Figures 7a and7b) [69]. The front-side processing of the C-HEMT device is combined with bulk silicon micromachining in this technology.…”
Section: Fabrication Of Gan Membranes and Device Structures By Means Of Double-side Micromachining Processing With Uv Lithographymentioning
confidence: 99%