Micromachined inertial sensors for vehicles

Barbour, N.; Brown, Eric J.; Connelly, J.; Dowdle, John; Brand, G.; Nelson, J.W.; O'Bannon, Janelle

doi:10.1109/itsc.1997.660620

Cited by 21 publications

(9 citation statements)

References 1 publication

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“…Owing to small size and low cost, micro-gyroscopes have been attracted a lot of attention and popularly employed in various applications, including consumer electronics (e.g., smart phone, camcorder image stabilization, camera stabilization, virtual reality and inertial mouse), Inertial Navigation Systems (INS), rollover detection and active suspension for Advanced Safety Vehicles (ASV), satellite posture control and etc [1]- [2]. Great deals of versatile design for micro-machined gyroscopes have been reported to either upgrade the performance or reduce the cost [3].…”

Section: Introductionmentioning

confidence: 99%

Design, fabrication and performance characterizations of an integrated dual-axis tuning fork gyroscope

et al. 2012

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This paper deals with the design, fabrication and preliminary experimental characterizations of a novel integrated dual-axis tuning fork gyroscope (DTFG). The DTFG is fabricated by high-aspect-ratio silicon-on-glass (SOG) process and vacuum packaged by glass frit bonding. Furthermore, a CMOS drive/readout ASIC chip, which is fabricated by a 0.25 µm 1P5M standard CMOS process, is integrated with the fabricated DTFG by directly wire-bonding. The experimental results of DTFG demonstrate that the rate sensitivities of Z-axis and X-axis sense modes are 1.47 mV/DPS and 0.18 mV/DPS respectively and the associated R2-linearity are 0.9995 and 0.9996. The noise-floors are 0.030 DPS/ Hz 1/2 and 0.247 DPS/Hz 1/2 for Z-axis and X-axis sense modes respectively.

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Section: Introductionmentioning

confidence: 99%

Design, fabrication and performance characterizations of an integrated dual-axis tuning fork gyroscope

et al. 2012

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“…Its application areas include inertial navigation, automotive stability control system, camera stabilization and robots control, etc [1]- [2]. Traditionally, optical gyroscopes are adopted because of the high accuracy.…”

Section: Introductionmentioning

confidence: 99%

A vibrating micro-resonator design for gyroscope applications using TIA

Chiu

Chen

Teng

et al. 2010

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

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This paper presents a vibrating micro-resonator using transimpedance amplifier (TIA) for gyroscope applications. First, a gyroscope model is built for sensor design. The critical parameters are optimized by theoretical calculation and fine tuned by finite-elementanalysis (FEM). Then, SOG-bulk micromachining and deep reactive ion etching (DRIE) are adopted to fabricate the gyroscope with high aspect-ratio sensing structure and high yield. Finally, an ASIC, TIA with large on-chip transimpedance is developed for driving loop to accomplish a self-oscillated micro-resonator.

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“…Among these methods, the anodic bonding technology is more often used, not only because the mechanical support, packaging and electrical contacts can be achieved at the same time, but also it is compatible with integrated circuits (IC) devices fabrication process due to the low bonding temperature. The Charles Stark Draper Laboratory [5][6] has used anodic bonding to fabricate gyroscopes and developed two sets of standard silicon on glass Contact author: fanxuejiao @ ime.pku .edu.cn (SaG) micro-fabrication technologies. The national key laboratory of nano/ micro fabrication technology of Peking University [7] has developed bulk-silicon standard fabrication technology, using anodic bonding as the critical process step.…”

Section: Introductionmentioning

confidence: 99%

Parameter characterization of anodic bonded electrical interconnect in MEMS/NEMS devices

Fan

Zhang

2009

2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

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The approach to realize the electrical interconnect and qualities of the contact have a direct impact on the performance and reliability of devices. Herein, Si-AulPt/Ti contact structure is fabricated using anodic bonding as a novel approach to realize the electrical interconnect. In order to evaluate the qualities of the anodic bonded contact, the contact resistance is extracted. The cross-bridge Kelvin method is optimized and a new method is presented to directly measure the contact resistance, named four-terminals bonded vertical Kelvin method (BVD). The two-dimensional resistor network model of the BVD method indicates that the relationship between the contact resistance and the measured resistance can be easily established. The BVD method can directly and precisely measure the contact resistance since kinds of interferences from parasitic resistances are minimized. Data obtained from the test indicate that the anodic bonded contact is Ohmic contact when the area of the contact is larger than 15*20pm 2 with the contact length not smaller than 15pm; whereas, the contact is not Ohmic contact and not stable when the area of the contact is smaller than 15*20pm 2 • The qualities of small-size anodic bonded contact is related with the effects of interfacial states, native oxide layer, series resistances at the interface, and the other particularities such as interfacial inter-diffusion, Au/Si eutectic reaction and surface topology.

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Micromachined inertial sensors for vehicles

Cited by 21 publications

References 1 publication

Design, fabrication and performance characterizations of an integrated dual-axis tuning fork gyroscope

Design, fabrication and performance characterizations of an integrated dual-axis tuning fork gyroscope

A vibrating micro-resonator design for gyroscope applications using TIA

Parameter characterization of anodic bonded electrical interconnect in MEMS/NEMS devices

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