Microgrippers fabricated by the LIGA technique

Ballandras, S.; Basrour, Skandar; Robert, Laurent; Megtert, S.; Blind, P.; Rouillay, M.; Bernede, P.; Daniau, W.

doi:10.1016/s0924-4247(97)01396-4

Cited by 45 publications

(25 citation statements)

References 12 publications

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“…One study reported a Young's modulus of 156GPa at 70mA/cm 2 and 131GPa at 200mA/cm 2 in the nickel sulfate bath [6]. Another study concluded that Young's modulus decreased from 182 to 168GPa when the current density increased from 10 to 20mA/cm 2 in the nickel sulphamate plating condition [8].…”

Section: Resultsmentioning

confidence: 99%

“…Surprisingly, little effort has been made to clarify the mechanical properties of electroplated metal films and their relationship with process conditions. Many different methods have been developed to determine the mechanical properties of thin film materials such as measuring the capacitance-voltage on bridge structure, measuring the deflection of the fabricated structures under external load or self-deformation, the optical X-rays method, and the step profiler method [5][6][7][8][9]. Unfortunately, most of these measurement methods require special microfabricated structures or special test fixtures.…”

Section: Introductionmentioning

confidence: 99%

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Sensitivity analysis of plating conditions on mechanical properties of thin film for MEMS applications

Woo

Kim

2011

J Mech Sci Technol

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In this paper, we report the detailed investigation into the effects of plating temperature and applied current density upon the mechanical properties of plated nickel film such as Young's modulus and residual stresses. This method uses the resonance method of atomic force microscope, which does not require specially microfabricated cantilevers and additional experimental set-up. Thin layers of nickel are electroplated onto the tip surface of AFM cantilevers and plating thicknesses were measured at the end of each plating step. The selfdeformation of the released AFM cantilever is also measured as a function of the plated nickel thickness, which is converted into the quantitative residual stress by appropriate mechanics. The measured Young's modulus is as high as that of bulk nickel at low plating temperature and at low applied current density, but drastically drops at high temperature or current density. The dependence of Young's modulus on the plating thickness is negligible in thin film less than few microns. The residual stress is also a strong function of the process conditions, and decreased with the elevation of the current density and plating temperature. And the intrinsic and extrinsic stresses of plated nickel are separated from the measured residual stress, and correlated with plating conditions. Dependence of the plated thickness on Young's modulus and residual stress is also considered.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Sensitivity analysis of plating conditions on mechanical properties of thin film for MEMS applications

Woo

Kim

2011

J Mech Sci Technol

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“…Ballandras et al [4] discussed the fabrication and design of a micro-gripper using LIGA (German acronym for Lithography, Electroplating, and Molding) process; a set of experiments were conducted to study the behavior of the gripper. The experimental results emphasized the importance of annealing in order to release the internal stress on the gripper.…”

Section: Gripping Techniques For Micro-part Manipulationmentioning

confidence: 99%

A review of micro-devices assembly techniques and technology

Cecil

Kumar

Lü

et al. 2015

Int J Adv Manuf Technol

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This paper provides a review of techniques and technology relevant to the field of micro-devices assembly (MDA). MDA is an emerging domain of importance which is expected to have a substantial impact on a range of industrial fields including sensors, surveillance devices, and semiconductor devices. This paper provides a review of a cross-section of research including micro-gripping design and manipulation techniques, work cell design and factory automation, selfassembly techniques, and virtual reality-based approaches in micro-assembly. A discussion of the key challenges for this domain along with directions for future research is also provided.

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“…For example, microgrippers have been fabricated using the Lithographie Galvanoformung Abformung (LIGA) technique. 17 The devices built up in this manner are made from electroformed nickel.…”

Section: Actuatorsmentioning

confidence: 99%

Advancements in MEMS materials and processing technology

Olivas

Bolin²

1998

JOM

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From achievements in display imaging to air bag deployment, microelectromechanical systems are becoming more commonplace in everyday life. With an abundance of opportunities for innovative R&D in the field, the research trends are not only directed toward novel sensor and actuator development, but also toward further miniaturization, specifically achieving micro-and nanoscaled integrated systems. R&D efforts in space, military, and commercial applications are directing specific research programs focused on the area of materials science as an enabling technology to be exploited by researchers and to further push the envelope of micrometerscaled device technology. These endeavors are making significant progress in bringing this aspect of the microelectro-mechanical field to maturation through advances in materials and processing technologies.

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Microgrippers fabricated by the LIGA technique

Cited by 45 publications

References 12 publications

Sensitivity analysis of plating conditions on mechanical properties of thin film for MEMS applications

Sensitivity analysis of plating conditions on mechanical properties of thin film for MEMS applications

A review of micro-devices assembly techniques and technology

Advancements in MEMS materials and processing technology

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