Microelectronics Packaging—An Overview

Aspects of the transfer of the Saxon-Magdeburg Law to Central and Eastern Europe

“…Firstly, a number of events and conferences could be presented here, including the international conference in Vilnius (Lithuania) organized in 2004 to commemorate the 475 th anniversary of the First Lithuanian Statute (1529), or an interna-tional conference in Kiev on the 500 th anniversary of the Magdeburg-Law-privilege for the Ukrainian capital (1999). 67 Moreover, the literature and sources recently published in Poland, 68 Hungary, 69 Belarus 70 and in the Baltic states 71 demonstrates the force of Saxon-Magdeburg Law as a vital subject for further research.…”

Simulation of Mechanical Stresses in BaTiO3 Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models

“…Electronic devices are usually manufactured in a standardized architectural concept, which outlines the process sequences and the interconnect interfaces, in order to manage the complex assembly process which spans over orders of magnitude in the dimensions of individual structural elements and processes and includes a large number of different materials. After the manufacturing of single electronic components (e.g., ICs, capacitors, resistors) at the interconnect levels 0 and 1, the first functional electronic circuits are assembled in the second interconnect level by connecting the components on a substrate (e.g., PCB, flex, ceramic carrier) before these functional units are wired to the final devices or systems at the interconnect levels 3 to 5 [ 1 , 2 , 3 , 4 , 5 , 6 ]. Therefore, the second interconnect level marks the central assembly step, where the functionality of electronic circuits is brought to life.…”

Nanoporous Thin Films Based on Polylactide-Grafted Norbornene Copolymers

“…High performance polymers, such as polyimides, polyesters, and polynorbornenes, have found a wide range of applications within electronic devices . And also a new organic thermoset polymer, SiLK resin developed by DOW Chemical, was recently developed for faster, smaller, and higher performance integrated circuits. − Despite their acceptable performance, new packaging materials with improved mechanical properties and lower dielectric constant are still required in order to reduce the time-of-flight and the cross-talk, leading to lowering power supply inductance, capacitance loading, and off-chip driver power . To satisfy these requirements, a promising approach would be the incorporation of nanopores within a polymer matrix. − Nanopores would reduce the average film dielectric constant because the air gap possesses the lowest dielectric constant with a value of unity.…”