Microcoils fabricated by UV depth lithography and galvanoplating

Löchel, Bernd; Maciossek, A.; Rothe, Martina; Windbracke, W.

doi:10.1016/s0924-4247(97)80034-9

Cited by 33 publications

(18 citation statements)

References 7 publications

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“…We have developed a high-resolution flex-foil process for the realization of miniaturized Cu coils and combined it with an original way of fabricating miniaturized E-cores from ferrite wafers to realize inductors in the mm 3 volume range. We have measured inductance values in the 100 µH range at frequencies below 0.1 MHz.…”

Section: Discussionmentioning

confidence: 99%

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Three-dimensional miniaturized power inductors realized in a batch-type hybrid technology

Saidani

Gijs²

2002

J. Micromech. Microeng.

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We present a new hybrid technology for the realization of three-dimensional millimetre-size inductors for low-power (0.1-1 W) applications. Our devices consist of electroplated planar Cu coils, realized within a high-resolution (5 µm) polyimide flex-foil process, and mm-size ferrite magnetic cores, obtained by three-dimensional micropatterning of ferrite wafers using powder blasting microerosion. Our devices range in volume between 10 and 1.5 mm 3 and we characterize their inductive and resistive properties as a function of frequency.

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Section: Discussionmentioning

confidence: 99%

“…Inductance values of approximately 0.1-0.4 µH were reported at 1 kHz-1 MHz. Löchel et al [3] have used thick resist technology, sputtering and electroplating/etching methods to fabricate coils of a few mm size, based on NiFe core material. Inductance values of the order of 1 µH were reported at 125 kHz.…”

Section: Introductionmentioning

confidence: 99%

Three-dimensional miniaturized power inductors realized in a batch-type hybrid technology

Saidani

Gijs²

2002

J. Micromech. Microeng.

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“…For both 2-D and 3-D microcoils, a robust method must be developed to attach wires securely to the ends of the microcoils before their use in microcomponents is feasible. Lochel et al [55] used surface micromachining to construct a flat microcoil with an integrated contact bridge that connected the inner wire of the coil to an outer contact or bond pad. Their process included photolithographic patterning of a thick layer of photoresist followed by electroplating on the patterned surface.…”

Section: Conclusion and Recommendations For Future Work: Try Contactmentioning

confidence: 99%

Exploring the Feasibility of Fabricating Micron-Scale Components Using Microcontact Printing LDRD Final Report

Myers¹,

Ritchey²,

Stokes³

et al. 2003

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Many microfabrication techniques are being developed for applications in microelectronics, microsensors, and micro-optics. Since the advent of microcomponents, designers have been forced to modify their designs to include limitations of current technology, such as the inability to make three-dimensional structures and the need for piece-part assembly. Many groups have successfully transferred a wide variety of patterns to both two-dimensional and three-dimensional substrates using microcontact printing. Microcontact printing is a technique in which a self-assembled monolayer (SAM) is patterned onto a substrate by transfer printing. The patterned layer can act as an etch resist or a foundation upon which to build new types of microstructures. We created a gold pattern with features as small as 1.2 µm using microcontact printing and subsequent processing. This approach looks promising for constructing single-level structures such as microelectrode arrays and sensors. It can be a viable technique for creating three-dimensional structures such as microcoils and microsprings if the right equipment is available to achieve proper alignment, and if a means is available to connect the final parts to other components in subsequent assembly operations. Microcontact printing provides a wide variety of new opportunities in the fabrication of microcomponents, and increases the options of designers.4

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“…They are related to the true secondary capacitance and the true load resistance by (3) and (4). Finally, and are the number of turns of the windings of the primary, respectively, the secondary (3) (4) Thus, when the secondary is short circuited ( ), the resonance frequency is given by (5) while, when it is open, the resonance frequency is given by (6) where the total measured inductance . The inductances and of the primary circuit are reported in Fig.…”

Section: B Leakage Inductancementioning

confidence: 99%

“…Inductance values of 0.5 H were reported at 10 kHz. Löchel et al [5] have used thick resist technology, sputtering, and electroplating/etching methods to fabricate coils of a few mm size based on NiFe core material. Microtransformers of 5 mm size integrated with diodes on a Si wafer were reported by Mino et al [6], [7].…”

mentioning

confidence: 99%

Batch-type millimeter-size transformers for miniaturized power applications

2001

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Abstract-We have developed a novel batch-type technology for making three-dimensional (3-D) millimeter-sized transformers for ultrasmall low-power (0.1 to 1 Watt) applications. The technology uses the 3-D micropatterning of ferrite wafers by powder blasting to form the magnetic cores of the inductive devices, and combines these cores with electrical windings made by flex-foil printed circuit board technology. Microfabrication and assembly of the parts can be done in a batch process on a wafer/foil level, opening the way to further size reduction of the components. We have measured the inductive and resistive properties of our devices as a function of frequency and device geometry. The results clearly show the high potential of our technology for power applications in which small-size is important.

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Microcoils fabricated by UV depth lithography and galvanoplating

Cited by 33 publications

References 7 publications

Three-dimensional miniaturized power inductors realized in a batch-type hybrid technology

Three-dimensional miniaturized power inductors realized in a batch-type hybrid technology

Exploring the Feasibility of Fabricating Micron-Scale Components Using Microcontact Printing LDRD Final Report

Batch-type millimeter-size transformers for miniaturized power applications

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