Microcavity LED-based parallel data link using small-diameter (125 m) plastic optical fibres

Bockstaele, Ronny; Hove, An Van; Coosemans, Thierry; Sys, Christa; Moerman, Ingrid; Dhoedt, Bart; Baets, Roel; Daele, Peter Van; Koetsem, J. Van; Torren, L. Van der

doi:10.1088/1464-4258/1/2/022

Cited by 7 publications

(3 citation statements)

References 3 publications

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“…Research groups all over the world are presently exploring various optical schemes to interconnect densely-packed photonic pin-outs regularly distributed over entire CMOS chip areas. Most of these implementations are based on beamguiding approaches either combining or embedding rib waveguides, individual fibers or imaging fiber-bundles into flexible [8,9] or rigid [10] modules. A second route is the use of freespace structures that use macro-optics [11,12], micro-optics [13,14] or planar optics [15] to shape and direct the light beams from transmitter to detector array.…”

Section: The Conceptmentioning

confidence: 99%

Low-cost microoptical modules for mcm level optical interconnections

Debaes

Vervaeke

Baukens

et al. 2003

IEEE J. Select. Topics Quantum Electron.

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A multi-channel free-space micro-optical module for dense MCM-level optical interconnections has been designed and fabricated. Extensive modeling proves that the module is scalable with a potential for multi-Tb/s.cm 2 aggregate bit rate capacity while alignment and fabrication tolerances are compatible with present-day mass replication techniques. The micro-optical module is an assembly of refractive lensletarrays and a high-quality micro-prism. Both components are prototyped using deep lithography with protons and are monolithically integrated using vacuum casting replication technique. The resulting 16-channel high optical-grade plastic module shows optical transfer efficiencies of 46% and interchannel cross talks as low as-22 dB, sufficient to establish workable multi-channel MCM-level interconnections. This micro-optical module was used in a feasibility demonstrator to establish intra-chip optical interconnections on a 0.6µm CMOS opto-electronic field programmable gate array. This opto-electronic chip combines fully functional digital logic, driver and receiver circuitry and flip-chipped VCSEL and detector arrays. With this test-vehicle multi-channel on-chip data-communication has been achieved for the first time to our knowledge. The bit rate per channel was limited to 10Mb/s because of the limited speed of the chip tester.

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Section: The Conceptmentioning

confidence: 99%

Low-cost microoptical modules for mcm level optical interconnections

Debaes

Vervaeke

Baukens

et al. 2003

IEEE J. Select. Topics Quantum Electron.

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“…There already exist two different approaches: guided-wave and free-space. The guided-wave approach uses fibers or fiber bundles to confine the photons and guide them over several tens of centimeters 13,14,15 . Free-space optical interconnects use macro-optics 16,17,18,19 , micro-optics 20,21,22 or planar optics 23 to shape and direct the light beams from transmitter to detector.…”

Section: The Micro-optical Pathway Blockmentioning

confidence: 99%

Multichannel free-space intrachip optical interconnections: combining plastic micro-optical modules and VCSEL-based OE-FPGA

et al. 2002

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We fabricated and replicated in semiconductor compatible plastics a multi-channel free-space optical interconnection module designed to establish intra-chip interconnections on an Opto-Electronic Field Programmable Gate Array (OE-FPGA). The micro-optical component is an assembly of a refractive lenslet-array and a high-quality microprism. Both components were prototyped using deep lithography with protons and were monolithically integrated using a vacuum casting replication technique. The resulting 16 channel module shows optical transfer efficiencies of 50% and interchannel cross-talks as low as -22 dB. These characteristics are sufficient to establish multi-channel intra-chip interconnects with OE-FPGA's.The OE-FPGA we used was designed within a European co-founded MEL-ARI consortium, working towards a manufacturable solution for optical interconnects between CMOS IC's. The optoelectronic chip combines fully functional FPGA digital logic with the drivers, receivers and flip-chipped optoelectronic components. It features 2 optical inputs an 2 optical outputs per FPGA cell, amounting to 256 photonic I/O links based on multi-mode 980 nm VCSELs and InGaAs detectors.With a careful alignment of the micro-optical free-space module above the OE-VLSI chip, we demonstrated for the first time to our knowledge a multi-channel free-space intra-chip optical interconnection. Data-communication was achieved with 4 simultaneous channels working at 10Mb/s. The bitrate was limited by the chiptester. Notwithstanding the use of non-aggressive 0.6 µm CMOS technology the FPGA will provide an 80 Mbit/s information rate per channel using manchester encoded links. The whole chip therefore has in principle a peak aggregate signalling rate of approximately 20 GBit/s. This first demonstration paves the way for a practical solution to solve the electronic intra-chip interconnect bottleneck with low-cost mass-producible chip-compatible plastic micro-optical modules.

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“…Most of these implementations are based on a beam-guiding approach. They either combine or embed rib wave-guides, individual fibers or imaging fiber-bundles into flexible [14,15] or rigid [16] modules. A second route is the use of free-space beam-shaping and beam-delivering micro-optical structures combined in compact hybrid or monolithic modules [17,18].…”

mentioning

confidence: 99%

Plastic micro-optical modules for high-throughput interchip optical interconnections

Thienpont

Baukens

Ottevaere³

et al. 2000

SPIE Proceedings

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We report on the design, the fabrication, the characterization and the demonstration of scalable multi-channel free-space interconnection components with the potential for Tb/s.cm 2 aggregate bit rate capacity over inter-chip interconnection distances. The demonstrator components are fabricated in a high quality optical plastic, PMMA, using an ion-based rapid prototyping technology that we call deep proton lithography. With the presently achieved Gigabit/s data rates for each of the individual 16 channels with a BER smaller than 10 -13 and with inter-channel cross-talk lower than -22dB the module aims at optically interconnecting 2-D opto-electronic VCSEL and receiver arrays, flip-chip mounted on CMOS circuitry. Furthermore, using ray-tracing software and radiometric simulation tools, we perform a sensitivity analysis for misalignment and fabrication errors on these plastic micro-optical modules and we study industrial fabrication and material issues related to the mass-replication of these components through injection-molding techniques. Finally we provide evidence that these components can be mass-fabricated in dedicated, highly-advanced optical plastics at low cost and with the required precision.

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Microcavity LED-based parallel data link using small-diameter (125 m) plastic optical fibres

Cited by 7 publications

References 3 publications

Low-cost microoptical modules for mcm level optical interconnections

Low-cost microoptical modules for mcm level optical interconnections

Multichannel free-space intrachip optical interconnections: combining plastic micro-optical modules and VCSEL-based OE-FPGA

Plastic micro-optical modules for high-throughput interchip optical interconnections

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