Microbonds for Hybrid Microcircuits

Riben, A. R.; Sherman, Stanislav; Land, W. V.; Geisler, Reinhard

doi:10.1109/irps.1966.362384

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The Effect Of Loop Height On Bond Pull Strength1

Table I1

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1974

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Cited by 4 publications

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“…Such a criterion has been used in the resistance welding field for many years with acceptable bond efficiencies generally ranging from about 50 to 90%, depending on circumstances. There have been several recent references that apply this bond efficiency concept to ultrasonic wire bonding [18,19].…”

Section: The Effect Of Loop Height On Bond Pull Strengthmentioning

confidence: 99%

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Microelectronic ultrasonic bonding

Harman¹

1974

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for their suggestions on the manuscript organization as well as their assistance in proof reading the final copy.I am especially grateful for the original editorial work of W. M. Bullis, editor of the Quarterly report series "Methods of Measurement for Semiconductor Materials, Process Control and Devices." The manuscript was expertly prepared by Miss B. S. Hope. vi MICROELECTRONIC ULTRASONIC BONDING

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Section: The Effect Of Loop Height On Bond Pull Strengthmentioning

confidence: 99%

“…Bond monitoring studies, [58][59][60][61][62][63][64][65][66][67][68][69][70][71][72][73] Bond pull strength, 18, 23, 25, 85-94 statistical evaluation, 24 Bond puller (glue, hook), [16][17][18] Bond screen (nondestructive) , 18 Bondability of sintered aluminum, 22 of gold wire, 94…”

Section: Table Imentioning

confidence: 99%