Micro-scale metallization of high aspect-ratio Cu and Au lines on flexible polyimide substrate by electroplating using SU-8 photoresist mask

Cho, Sung Hwoan; Kim, S. H.; Lee, J. G.; Lee, N. E.

doi:10.1016/j.mee.2004.09.007

Cited by 35 publications

(9 citation statements)

References 35 publications

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“…The metals also display different degrees of biocompatibility [25,26], costs per unit weight, ability to act as diffusion barriers [27], and potential for creating magnetic alloys [28].…”

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confidence: 99%

Direct metallisation of polyetherimide substrates by activation with different metals

Jones

Ryspayeva

Esfahani

et al. 2019

Surface and Coatings Technology

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This article reports the performance of different metallic ions and nanoparticles (Ag, Cu, Ni, Pd, Cr, Co, Au and Fe) used as seed layers, formed by chemical or optical reduction, for the electroless Cu plating of metal tracks onto polyetherimide (PEI). Plated Cu performance was tested by adhesion, electrical conductivity, plating rate, XPS, SEM, XRD and EDX analysis. The application of Cu and Ag seeds resulted in high quality electroless Cu deposits presenting strong adhesion properties and high conductivity ((2.0 ± 0.5) ×10 7 S/m and (3.6 ± 0.2) ×10 7 S/m, respectively) compared with bulk copper (5.96 ×10 7 S/m). Performance is attributed to the high surface density and uniformity of seed layers. Of the metals, only Ag ions were photoreduced under the conditions applied and were subsequently used to electroless Cu plate high quality track features of 150 µm width. The application of sulphuric acid pre-treatment to PEI prior to Ag ion exchange, improved the photoinitiated track formation process, as demonstrated by a threefold increase to both photoinduced Ag nanoparticle density on the surface and electroless Cu plating rate, as well as improved electroless Cu adhesion to PEI.

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“…The metals also display different degrees of biocompatibility [25,26], costs per unit weight, ability to act as diffusion barriers [27], and potential for creating magnetic alloys [28].…”

mentioning

confidence: 99%

Direct metallisation of polyetherimide substrates by activation with different metals

Jones

Ryspayeva

Esfahani

et al. 2019

Surface and Coatings Technology

View full text Add to dashboard Cite

show abstract

“…Several studies have attempted to coat metal nanoparticles onto soft substrates through techniques such as vapour phase deposition [16], chemical vapour deposition [17,18,19] and electro-deposition [20,21,22]. However, the fabrication via such methods does not have chemical bonds or any other tethering force between the metallic layer and the original substrates.…”

Section: Introductionmentioning

confidence: 99%

Polymer Interface Molecular Engineering for E-Textiles

Zhu

Liu

2018

Polymers

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Wearable electronics, regarded as the next generation of conventional textiles, have been an important concept in the study of e-textiles. Conductive fibres are the upstreaming of e-textiles and have witnessed the booming development in recent years. However, little work has focused on improving the wash ability and durability of conductive fibres. As a new approach to manufacturing conductive fibres, Polymer Interface Molecular Engineering (PIME) is starting to be employed recently, to build up an interfacial layer on polymeric fibre surfaces; this interfacial layer services as a platform to anchor catalysts for the following metal Electroless Deposition (ELD). The designed interfacial layer significantly increases adhesion between polymeric substrates and coating metal layers, to improve the durability of e-textiles. This review highlights recent research into different molecular and architectural design strategies, and its potential application for wearable electronics. Further challenges and opportunities in this field are also discussed critically.

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“…Indeed, pioneering works by the groups of Rogers, Suo, and Someya have demonstrated that metal can be engineered into flexible and stretchable forms. [18][19][20][21] Compared with other accomplished metallization methods, such as physical vapor deposition, [22] chemical vapor deposition, [23,24] and electrochemical plating, [25][26][27] electroless deposition (ELD) has recently emerged as a versatile and low-cost tool for making high-quality metal structures on flexible and stretchable substrates. It is particularly suitable for plastic substrates because the process does not require high-temperature treatment, expensive equipment, or conducting substrates.…”

Section: Introductionmentioning

confidence: 99%

Surface‐Grafted Polymer‐Assisted Electroless Deposition of Metals for Flexible and Stretchable Electronics

Liu

Zhou

et al. 2012

Chemistry An Asian Journal

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Surface-grafted polymers, that is, ultrathin layers of polymer coating covalently tethered to a surface, can serve as a particularly promising nanoplatform for electroless deposition (ELD) of metal thin films and patterned structures. Such polymers consist of a large number of well-defined binding sites for highly efficient and selective uptake of ELD catalysts. Moreover, the polymer chains provide flexible 3D network structures to trap the electrolessly deposited metal particles, leading to strong metal-substrate adhesion. In the past decade, surface-grafted polymers have been demonstrated as efficient nanoplatforms for fabricating durable and high-performance metal coatings by ELD on plastic substrates for applications in flexible and stretchable electronics. This focus review summarizes these recent advances, with a particular focus on applications in polymeric flexible and stretchable substrates. An outlook on the future challenges and opportunities in this field is given at the end of this paper.

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Micro-scale metallization of high aspect-ratio Cu and Au lines on flexible polyimide substrate by electroplating using SU-8 photoresist mask

Cited by 35 publications

References 35 publications

Direct metallisation of polyetherimide substrates by activation with different metals

Direct metallisation of polyetherimide substrates by activation with different metals

Polymer Interface Molecular Engineering for E-Textiles

Surface‐Grafted Polymer‐Assisted Electroless Deposition of Metals for Flexible and Stretchable Electronics

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