Micro Pirani vacuum gauges manufactured by a film transfer process

Schelcher, Guillaume; Lefeuvre, Élie; Brault, Sebastien; Parrain, Fabien; Martincic, Émile; Dufour-Gergam, Elisabeth; Bosseboeuf, Alain

doi:10.1016/j.proeng.2010.09.311

Cited by 3 publications

(3 citation statements)

References 8 publications

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“…Figure 4b shows a double-clamped nickel microbeam that we employed and characterized as highly sensitive micro Pirani vacuum gauge. 32 The gap between Ni structures and the Si target substrate directly relies on the BCB sealing ring thickness after bonding which can be lower that initial BCB thickness prior to bonding. Due to BCB viscous state during bonding and high bonding force, the BCB sealing rings thickness tends to be lowered.…”

Section: Process Developmentmentioning

confidence: 99%

MEMS Process by Film Transfer Using a Fluorocarbon Anti-Adhesive Layer

Schelcher¹,

Brault²,

Parrain³

et al. 2011

J. Electrochem. Soc.

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Section: Process Developmentmentioning

confidence: 99%

MEMS Process by Film Transfer Using a Fluorocarbon Anti-Adhesive Layer

Schelcher¹,

Brault²,

Parrain³

et al. 2011

J. Electrochem. Soc.

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“…Figure 5 shows typical SEM pictures of transferred microstructures on a Si host wafer. Figure 5.b shows a double-clamped nickel microbeam that we employed and characterized as highly sensitive micro Pirani vacuum gauge (15). ring thickness after bonding which can be lower that initial BCB thickness prior to bonding.…”

Section: Process Developmentmentioning

confidence: 99%

MEMS Process by Film Transfer Using Fluorocarbon Anti-Adhesive Layer

Schelcher

Brault²,

Parrain

et al. 2010

ECS Trans.

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A low cost and low temperature MEMS transfer process is presented. The process is based on adhesion control of molded electroplated Ni microstructures on donor wafer by using plasma deposited fluorocarbon film. Adhesive bonding of the microstructures on the target wafer using BCB sealing enables mechanical tearing out from the donor wafer. This proposed process has allowed us to realize from 7 µm down to 700 nm thick Ni patterns on Si, Pyrex glass wafers and Kapton foils. Multiple transfers lead to Ni stacked microstructures. Because this process is simple and only involves a low temperature (250°C) heating of the host wafer, it is highly versatile and suitable for various applications and brings new perspectives towards 3D integration of MEMS/NEMS.

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“…In recent decades, the development of MEMS technology has greatly promoted the miniaturization of traditional sensors [30][31][32][33][34][35][36][37][38][39][40][41][42][43]. The miniaturized Pirani sensors, also known as the MEMS Pirani sensors, can not only reduce the weight and size of the devices, but also can cut down power consumption and production costs [44][45][46][47][48][49][50][51][52][53][54][55]. Moreover, the MEMS technology can facilitate integration of Pirani sensors with other devices on one chip [56][57][58].…”

Section: Introductionmentioning

confidence: 99%

Overview of the MEMS Pirani Sensors

Zhou

Shi

et al. 2022

Micromachines

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Vacuum equipment has a wide range of applications, and vacuum monitoring in such equipment is necessary in order to meet practical applications. Pirani sensors work by using the effect of air density on the heat conduction of the gas to cause temperature changes in sensitive structures, thus detecting the pressure in the surrounding environment and thus vacuum monitoring. In past decades, MEMS Pirani sensors have received considerable attention and practical applications because of their advances in simple structures, long service life, wide measurement range and high sensitivity. This review systematically summarizes and compares different types of MEMS Pirani sensors. The configuration, material, mechanism, and performance of different types of MEMS Pirani sensors are discussed, including the ones based on thermistors, thermocouples, diodes and surface acoustic wave. Further, the development status of novel Pirani sensors based on functional materials such as nanoporous materials, carbon nanotubes and graphene are investigated, and the possible future development directions for MEMS Pirani sensors are discussed. This review is with the purpose to focus on a generalized knowledge of MEMS Pirani sensors, thus inspiring the investigations on their practical applications.

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Micro Pirani vacuum gauges manufactured by a film transfer process

Cited by 3 publications

References 8 publications

MEMS Process by Film Transfer Using a Fluorocarbon Anti-Adhesive Layer

MEMS Process by Film Transfer Using a Fluorocarbon Anti-Adhesive Layer

MEMS Process by Film Transfer Using Fluorocarbon Anti-Adhesive Layer

Overview of the MEMS Pirani Sensors

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